The structure composition, principle and function of wave soldering
The current wave soldering is usually composed of plate loading system, flux coating system, preheat...
The current wave soldering is usually composed of plate loading system, flux coating system, preheat...
According to the requirements and requirements of failure analysis, it is necessary to adopt various...
Basic principles of SMB design: layout, wiring, wire width, printed wire spacing, selection of compo...
Optimization design skills of circuit board heat dissipation :1. Heat dissipation by PCB board itsel...
Surface mount technology is very convenient in the manufacture of many PCBS. Reliable and fast profe...
SMT patch processing main characteristics: 1, high density: 2, small aperture: 3, low coefficient of...
Common treatment methods are added sewing capacitor and bridge :1, sewing capacitor, 2, bridge, 3, m...
Manual welding methods for SMT patch processing of leadless chip components: one by one welding spot...
There are the following factors affecting PCB welding quality: PCB diagram, circuit board quality, d...
PCB design service process: 1. The customer provides schematic diagram to consult PCB design; 2. 2. ...
The reasons for the need for post-welding processing are as follows: 1, the components are not resis...
SMT SMT technology: The main content of surface assembly technology can be divided into four parts: ...