Kingford focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short lead time".

BGA Assembly

FPGA BGA assembly patch manufacturer

FPGA BGA assembly patch manufacturer

Name: FPGA PCB assembly patch manufacturer

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station

Placement speed: chip component placement speed (at best conditions) 0.036 S/piece

The SMAllest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, Flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

Medical BGA motherboard assembly

Medical BGA motherboard assembly

Name: MedICal BGA Motherboard

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: chip component placement speed (at best conditions) 0.036 S/piece

The SMAllest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, Flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

BGA industrial control motherboard assembly

BGA industrial control motherboard assembly

Name: BGA industrial control motherboard assembly

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station

Placement speed: chip component placement speed (at best conditions) 0.036 S/piece

The SMAllest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

Communication module BGA assembly

Communication module BGA assembly

Name: Communication module BGA assembly

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 20 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station

Placement speed: chip component placement speed (at best conditions) 0.036 S/piece

The SMAllest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

Consumer Electronics BGA assembly

Consumer Electronics BGA assembly

Name: Consumer Electronics BGA assembly

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 20 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station

Placement speed: chip component placement speed (at best conditions) 0.036 S/piece

The SMAllest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

Industrial control board BGA assembly

Industrial control board BGA assembly

Name: Industrial control board BGA assembly

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 20 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station

Placement speed: chip component placement speed (at best conditions) 0.036 S/piece

The SMAllest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

Huawei 4G communication module BGA assembly

Huawei 4G communication module BGA assembly

Name: Huawei 4G communication module BGA assemblyed

Number of SMT lines: 5 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station

Placement speed: chip component placement speed (at best conditions) 0.036 S/piece

The SMAllest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, Flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

Amlogic Solution Multimedia Motherboard BGA assembly

Amlogic Solution Multimedia Motherboard BGA assembly

Name: AmlogIC Solution Multimedia Motherboard BGA assembly

Number of SMT lines: 5 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: chip component placement speed (at best conditions) 0.036 S/piece

The SMAllest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, Flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

SMT capacity: 19 million points/day
Testing EquipmentX-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speedChip placement speed (at best conditions) 0.036 S/piece
Mounted Component SpecificationsPasteable smallest package
Minimum device accuracy
IC type chip accuracy
Mounted PCB SpecificationsSubstrate size
Substrate thickness
throw rate1. Resistance-capacitance ratio 0.3%
2. IC type without throwing material
Board TypePOP/common board/FPC/rigid-flex board/metal substrate

DIP daily production capacity
DIP plug-in production line50000 points/day
DIP post welding production line20000 points/day
DIP test production line50000pcs PCBA/day

Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month

PCBA processing capability
projectMass processing capabilitySmall batch processing capability
Number of layers (max)2-1820-30
Plate typeFR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg SheetPTFE, PPO, PPE
Rogers,etc TeflonE-65, ect
Sheet mixing4 layers - 6 layers6th floor - 8th floor
biggest size610mm X 1100mm/
Dimensional Accuracy±0.13mm±0.10mm
Plate thickness range0.2mm--6.00mm0.2mm--8.00mm
Thickness tolerance ( t≥0.8mm)±8%±5%
Thickness tolerance (t<0.8mm)±10%±8%
Media thickness0.076mm--6.00mm0.076mm--0.100mm
Minimum line width0.10mm0.075mm
Minimum spacing0.10mm0.075mm
Outer copper thickness8.75um--175um8.75um--280um
Inner layer copper thickness17.5um--175um0.15mm--0.25mm
Drilling hole diameter (mechanical drill)0.25mm--6.00mm0.15mm--0.25mm
Hole diameter (mechanical drill)0.20mm--6.00mm0.10mm--0.20mm
Hole Tolerance (Mechanical Drill)0.05mm/
Hole tolerance (mechanical drill)0.075mm0.050mm
Laser Drilling Aperture0.10mm0.075mm
Plate thickness aperture ratio10:112:1
Solder mask typePhotosensitive green, yellow, black, purple, blue, ink/
Minimum Solder Mask Bridge Width0.10mm0.075mm
Minimum Solder Mask Isolation Ring0.05mm0.025mm
Plug hole diameter0.25mm--0.60mm0.60mm-0.80mm
Impedance tolerance±10%±5%
Surface treatment typeHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card boardImmersion Tin, OSP
Automatic solder paste printing machine

Automatic solder paste printing machine

AOI Optical Inspection

AOI Optical Inspection

SMT high-speed placement machine

SMT high-speed placement machine

Nitrogen reflow soldering

Nitrogen reflow soldering

x-ray

x-ray

Three anti-paint spraying machine

Three anti-paint spraying machine

SPI Solder Paste Thickness Tester

SPI Solder Paste Thickness Tester

Automatic wave soldering machine

Automatic wave soldering machine

first article inspection

first article inspection

Kingford
Why choose us?
Efficient quotation
Efficient quotation

Our complete turnkey PCB assembly service provides a 24 hour quote service for your turnkey PCB assembly order.

All-round and reliable parts supplier
All-round and reliable parts supplier

Kingford cooperates with world-renowned component suppliers to ensure that the source of electronic components is plastic and the authenticity is guaranteed.

Advanced equipment
Advanced equipment

It has 7 fully automatic SMT high-speed chip production lines, equipped with ten temperature zone nitrogen reflow ovens, online AOI, SPI, X-RAY and other equipment.

Quality assurance
Quality assurance

We have complete ISO9001, ISO13485, ISO14001, IATF 16949, UL and other system certifications, and our products meet environmental protection requirements.

Kingford
Our PCB&PCBA Solutions

The company has successively cooperated with more than 3,000 high-tech R&D, manufacturing and service companies around the world, with technical solutions covering medical, industrial control, artificial intelligence, Internet of Things, automotive electronics, smart home and other fields.

Kingford
BGA Assembly FAQ
1.Do you undertake BGA rework?

Yes! You can rely on our BGA rework services to ensure optimum performance.

2.What is the test for BGA printed circuit board assembly?
For BGA printed circuit board assembly, we have strict testing protocols including: X-ray inspection, functional testing, automated optical inspection.
3.What are your BGA assembly capabilities?

Our BGA printed circuit board capabilities cover the following: Micro Ball Grid Array (µBGA), Thin Chip Array Ball Grid Array (CTBGA), Chip Array Ball Grid Array (CABGA), Ultra Thin Chip Array Ball Grid Array (CVBGA), Fine Pitch Ball Grid Array (VFBGA), Land Grid Array (LGA), Chip Scale Package (CSP), Wafer Level Chip Scale Package (WLCSP)

4.What are the factors that affect the quality of BGA assembly?
Some of the factors that affect BGA assembly quality include checking laminate compatibility, warpage requirements, surface finish effects, solder mask clearance, etc.
5.What is BGA assembly?

BGA or Ball Grid Array is a high density PCB packaging technology widely used in integrated circuits and is a popular surface mount package due to the precision component placement it provides.

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