KINGFORD are focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short delivery period".
BGA Assembly
FPGA PCB assembly patch manufacturer

FPGA PCB assembly patch manufacturer

Name: FPGA PCB assembly patch manufacturer

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

Medical PCBA Motherboard

Medical PCBA Motherboard

Name: Medical PCBA Motherboard

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

4K HD audio and video motherboard PCBA

4K HD audio and video motherboard PCBA

Name: 4K HD audio and video motherboard PCBA

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

RK3399 scheme Android motherboard assembly

RK3399 scheme Android motherboard assembly

Name: RK3399 scheme Android motherboard assembly

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 20 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

Consumer Electronics PCBA

Consumer Electronics PCBA

Name: Consumer Electronics PCBA

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 20 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

Industrial Control Board PCBA

Industrial Control Board PCBA

Name: Industrial Control Board PCBA

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 20 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

Huawei 4G communication module PCBA

Huawei 4G communication module PCBA

Name: Huawei 4G communication module PCBA

Number of SMT lines: 5 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

Amlogic Solution Multimedia Motherboard PCBA

Amlogic Solution Multimedia Motherboard PCBA

Name: Amlogic Solution Multimedia Motherboard PCBA

Number of SMT lines: 5 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

High-end projector motherboard PCBA

High-end projector motherboard PCBA

Name: High-end projector motherboard PCBA

Number of SMT lines: 5 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

computer graphics card BGA PCBA

computer graphics card BGA PCBA

Name: computer graphics card BGA PCBA

Number of SMT lines: 5 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone motherboards, battery protection circuits and other difficult products

ItemProcess Capability Parameter
Order Quantity≥1PC
Quality GradeIPC-A-610
Lead Time24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you.
Size50*50mm~510*460mm
Board TypeRigid PCB, Flexible PCB, metal core PCB
Min Package01005 (0.4mm*0.2mm)
Max PackageNo limit
Mounting Accuracy±0.035mm(±0.025mm)  Cpk≥1.0 (3σ)
Surface FinishLead/Lead-free HASL, Immersion gold, OPS, etc.
Assembly TypesSurface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole)
Component SourcingTurnkey (All components sourced by PCBMay), Partial turnkey, Kitted/Consigned
BGA PackageBGA Dia. 0.14mm, BGA 0.2mm pitch
SMT Parts PresentationCut Tape, Partial reel, Reel,Tube, Tray, Laser-cut Stainless Steel
Cable AssemblyWe supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical and entertainment.
StencilStencil with or without frame (offered free by PCBMay)
Quality InspectionVisual inspection; AOI checking; BGA placement – X-RAY checking
SMT Capacity3 Million~4 Million Soldering Pad/day
DIP Capacity100 Thousand Pins/day


Automatic solder paste printing machine

Automatic solder paste printing machine

AOI Optical Inspection

AOI Optical Inspection

SMT high-speed placement machine

SMT high-speed placement machine

Nitrogen reflow soldering

Nitrogen reflow soldering

x-ray

x-ray

Three anti-paint spraying machine

Three anti-paint spraying machine

SPI Solder Paste Thickness Tester

SPI Solder Paste Thickness Tester

Automatic wave soldering machine

Automatic wave soldering machine

first article inspection

first article inspection

KINGFORD
Why choose us?
Efficient quotation
Efficient quotation

Our complete turnkey PCB assembly service provides a 24 hour quote service for your turnkey PCB assembly order.

All-round and reliable parts supplier
All-round and reliable parts supplier

Kingford cooperates with world-renowned component suppliers to ensure that the source of electronic components is plastic and the authenticity is guaranteed.

Advanced equipment
Advanced equipment

It has 7 fully automatic SMT high-speed chip production lines, equipped with ten temperature zone nitrogen reflow ovens, online AOI, SPI, X-RAY and other equipment.

Quality assurance
Quality assurance

We have complete ISO9001, ISO13485, ISO14001, IATF 16949, UL and other system certifications, and our products meet environmental protection requirements.

KINGFORD
Our PCB&PCBA Solutions
The company has successively cooperated with more than 3,000 high-tech R&D, manufacturing and service companies around the world, with technical solutions covering medical, industrial control, artificial intelligence, Internet of Things, automotive electronics, smart home and other fields.
KINGFORD
BGA Assembly FAQ
1.Do you undertake BGA rework?

Yes! You can rely on our BGA rework services to ensure optimum performance.

2.What is the test for BGA printed circuit board assembly?
For BGA printed circuit board assembly, we have strict testing protocols including: X-ray inspection, functional testing, automated optical inspection.
3.What are your BGA assembly capabilities?

Our BGA printed circuit board capabilities cover the following: Micro Ball Grid Array (µBGA), Thin Chip Array Ball Grid Array (CTBGA), Chip Array Ball Grid Array (CABGA), Ultra Thin Chip Array Ball Grid Array (CVBGA), Fine Pitch Ball Grid Array (VFBGA), Land Grid Array (LGA), Chip Scale Package (CSP), Wafer Level Chip Scale Package (WLCSP)

4.What are the factors that affect the quality of BGA assembly?
Some of the factors that affect BGA assembly quality include checking laminate compatibility, warpage requirements, surface finish effects, solder mask clearance, etc.
5.What is BGA assembly?

BGA or Ball Grid Array is a high density PCB packaging technology widely used in integrated circuits and is a popular surface mount package due to the precision component placement it provides.

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