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SMT electronic manufacturing equipment automation analysis
06Jun
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SMT electronic manufacturing equipment automation analysis

Technology refers to a technology in which chip components are mounted and welded on the surface of the printed circuit board. Compared with the traditional through hole assembly technology, the technology has the advantages of high assembly density.

SMT patch processing eliminates the opportunity for misalignment
06Jun
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SMT patch processing eliminates the opportunity for misalignment

The Chinese name of SMT chip processing (PCB) is called "printed circuit board", also known as printed circuit board, printed circuit board, is an important electronic component, is the support body of electronic components, is the provider of e...

Power PCB application tips for PCB design software
06Jun
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Power PCB application tips for PCB design software

In general, high density boards do not add ICT. If you want to add ICT, you can set test piont in the schematic and transfer it to the network table; It can also be added by hand.

Changing trends of crosstalk
06Jun
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Changing trends of crosstalk

Although this crosstalk noise to reduce the network transmission delay is helpful to improve the PCB timing, but in the actual PCB design, due to the uncertainty of the interference source network, this delay is uncontrollable, so the delay caused by this

Application of BGA Devices in Electronic Products
05Jun
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Application of BGA Devices in Electronic Products

Application of BGA Devices in Electronic ProductsThe large temperature difference △T in the chip range leads to the problem of different tin melting between rework and production, which prompts manufacturers to try to obtain the reason for simultaneous ti

   BGA Reliability Impact
05Jun
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BGA Reliability Impact

BGA Reliability ImpactSince flux directly affects electromigration and surface insulation resistance, cleaning is generally required after soldering, but flux cleaning at the bottom of BGA is a very tricky task, so it is recommended to use no-clean flux,

     BGA components and their assembly process
05Jun
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BGA components and their assembly process

BGA components and their assembly process(1) Visual inspectionFor package arrays such as BGA, without inspection equipment, first visually observe whether the collapse of the outermost solder joints is consistent, and then look at the chip against the lig

    FR4 Materials and Properties
04Jun
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FR4 Materials and Properties

FR4 Materials and PropertiesFR4 is a standard for glass fiber reinforced epoxy resin compounds defined by NEMA (National Electrical Manufacturers Association).FR stands for "flame retardant" in English and indicates that the material complies with the UL9

     Impedance design of PCB
04Jun
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Impedance design of PCB

Impedance design of PCB1. Definition of impedance:At a certain frequency, in the transmission signal line of an electronic device, relative to a certain reference layer, the resistance suffered by the high-frequency signal or electromagnetic wave during p

   PCB assembly in the medical industry
02Jun
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PCB assembly in the medical industry

PCB assembly in the medical industryPrinted circuit boards (PCBs) play an important role in healthcare and medicine. As the industry continues to innovate to bring the best technology to patients and their caregivers, more and more research, treatment and

  The specific steps and composition of printed circuit board (PCB)
02Jun
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The specific steps and composition of printed circuit board (PCB)

The specific steps and composition of printed circuit board (PCB)With the improvement of microelectronics technology and industrial manufacturing level, printed circuit board (PCB) has become the basic unit of all smart devices and systems. PCB can realiz

           PCB Assembly
02Jun
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PCB Assembly

PCB AssemblyIn our ongoing series describing the more common problems associated with printed circuit boards, we examine design, assembly, and manufacturing issues. Next, we'll focus on some issues that can affect the board during assembly. While some of

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