The solder resistance design between the pad and the pad, and the solder resistance graphic specifications should conform to the design of the welding end distribution of specific components; If the open window block welding between the pad and the pad ca
The tip of the solder joint may also be related to the poor connection between the leading end of the Component and the PCB pad. If the connection is poor, it will lead to the internal solder joint is not tight enough, and when the solder joint experience
First, to perform SMT SMT processing, you need to have a dedicated SMT machine. Before you begin processing, you need to check the state of the patch machine and ensure that it is working properly. Checking the condition of the patch machine includes clea
SMT processing materials on the PCBA welding quality of the impact of the following: 1, the impact of components, 2, PCB, 3, the impact of solder paste
PCBA processing and welding process is mainly divided into three parts: one is SMT reflow welding, two is DIP wave welding, three is manual soldering iron welding
The main measures to reduce the surface tension and viscosity in PCBA welding process are as follows: (1) increase the temperature, (2) adjust the proportion of metal alloy, (3) increase the active agent, and (4) improve the PCBA welding process environme
In order to ensure the smooth completion of the special process and facilitate the PCBA welding process, PCB board must meet the manufacturability requirements in dimensions, pad distance and other aspects
Pay attention to the wiring of signal lines under the magnetic beads, between the pads and those that may come into contact with the magnetic beads. Some magnetic beads conduct electricity quite well and may produce unexpected conductive paths.
In the dispensing process, the technical parameters of the patch glue and the dispensing machine can be changed as follows: (1) the rheology of the patch glue. (2) The initial adhesive strength of the patch adhesive. (3) glue point contour. (4) glue point
We should start from the design of PCBA lead-free products to consider the compatibility between lead-free materials, lead-free and design, lead-free and process compatibility; Give full consideration to heat dissipation; Carefully select PCB board, pad s
In the production process, it can be prevented in the following ways: 1, moisture-proof storage of components, 2, select good quality solder paste, 3, adjust printing parameters of false welding and false welding problems, 4, control the welding time, 5,
PCBA welding processing, usually PCB board has a lot of requirements, and must meet the requirements of the board to accept welding processing.