PCB Assembly from Rigid, Flex to Rigid Flex board with leaded & lead-free solder.
No minimum order requirement, order start from 1 pcs.
7/24 Live sales & tech support.
Full Range Of Reliable Suppliers For Components.
8-48 hours delivery time when components are ready.
We provide SMT placement, DIP plug-in, assembly and testing services. We have a 100,000-level dust-free SMT workshop of 4,000 square meters and a DIP dust-free processing workshop of 800 square meters. The daily SMT placement capacity can reach 19 million points, and the daily DIP plug-in can reach 10 Wan, Kingford carries out strict quality control on each process of PCB assembly, and has passed ISO9001, ISO13485, ISO14001, IATF 16949, UL and other authoritative certifications at home and abroad.
|SMT capacity: 19 million points/day|
|Testing Equipment||X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station|
|Placement speed||Chip placement speed (at best conditions) 0.036 S/piece|
|Mounted Component Specifications||Pasteable smallest package|
|Minimum device accuracy|
|IC type chip accuracy|
|Mounted PCB Specifications||Substrate size|
|throw rate||1. Resistance-capacitance ratio 0.3%|
|2. IC type without throwing material|
|Board Type||POP/common board/FPC/rigid-flex board/metal substrate|
|DIP daily production capacity|
|DIP plug-in production line||50000 points/day|
|DIP post welding production line||20000 points/day|
|DIP test production line||50000pcs PCBA/day|
|Assembly processing capability|
|The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month|
|PCBA processing capability|
|project||Mass processing capability||Small batch processing capability|
|Number of layers (max)||2-18||20-30|
|Plate type||FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet||PTFE, PPO, PPE|
|Rogers,etc Teflon||E-65, ect|
|Sheet mixing||4 layers - 6 layers||6th floor - 8th floor|
|biggest size||610mm X 1100mm||/|
|Plate thickness range||0.2mm--6.00mm||0.2mm--8.00mm|
|Thickness tolerance ( t≥0.8mm)||±8%||±5%|
|Thickness tolerance (t＜0.8mm)||±10%||±8%|
|Minimum line width||0.10mm||0.075mm|
|Outer copper thickness||8.75um--175um||8.75um--280um|
|Inner layer copper thickness||17.5um--175um||0.15mm--0.25mm|
|Drilling hole diameter (mechanical drill)||0.25mm--6.00mm||0.15mm--0.25mm|
|Hole diameter (mechanical drill)||0.20mm--6.00mm||0.10mm--0.20mm|
|Hole Tolerance (Mechanical Drill)||0.05mm||/|
|Hole tolerance (mechanical drill)||0.075mm||0.050mm|
|Laser Drilling Aperture||0.10mm||0.075mm|
|Plate thickness aperture ratio||10：1||12：1|
|Solder mask type||Photosensitive green, yellow, black, purple, blue, ink||/|
|Minimum Solder Mask Bridge Width||0.10mm||0.075mm|
|Minimum Solder Mask Isolation Ring||0.05mm||0.025mm|
|Plug hole diameter||0.25mm--0.60mm||0.60mm-0.80mm|
|Surface treatment type||Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board||Immersion Tin, OSP|