Kingford focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short lead time".

PCB Assembly Capability

SMT capacity: 19 million points/day
Testing EquipmentX-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speedChip placement speed (at best conditions) 0.036 S/piece
Mounted Component SpecificationsPasteable smallest package
Minimum device accuracy
IC type chip accuracy
Mounted PCB SpecificationsSubstrate size
Substrate thickness
throw rate1. Resistance-capacitance ratio 0.3%
2. IC type without throwing material
Board TypePOP/common board/FPC/rigid-flex board/metal substrate

DIP daily production capacity
DIP plug-in production line50000 points/day
DIP post welding production line20000 points/day
DIP test production line50000pcs PCBA/day

Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month

PCBA processing capability
projectMass processing capabilitySmall batch processing capability
Number of layers (max)2-2820-30
Plate typeFR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg SheetPTFE, PPO, PPE
Rogers,etc TeflonE-65, ect
Sheet mixing4 layers - 6 layers6th floor - 8th floor
biggest size610mm X 1100mm/
Dimensional Accuracy±0.13mm±0.10mm
Plate thickness range0.2mm--6.00mm0.2mm--8.00mm
Thickness tolerance ( t≥0.8mm)±8%±5%
Thickness tolerance (t<0.8mm)±10%±8%
Media thickness0.076mm--6.00mm0.076mm--0.100mm
Minimum line width0.10mm0.075mm
Minimum spacing0.10mm0.075mm
Outer copper thickness8.75um--175um8.75um--280um
Inner layer copper thickness17.5um--175um0.15mm--0.25mm
Drilling hole diameter (mechanical drill)0.25mm--6.00mm0.15mm--0.25mm
Hole diameter (mechanical drill)0.20mm--6.00mm0.10mm--0.20mm
Hole Tolerance (Mechanical Drill)0.05mm/
Hole tolerance (mechanical drill)0.075mm0.050mm
Laser Drilling Aperture0.10mm0.075mm
Plate thickness aperture ratio10:112:1
Solder mask typePhotosensitive green, yellow, black, purple, blue, ink/
Minimum Solder Mask Bridge Width0.10mm0.075mm
Minimum Solder Mask Isolation Ring0.05mm0.025mm
Plug hole diameter0.25mm--0.60mm0.60mm-0.80mm
Impedance tolerance±10%±5%
Surface treatment typeHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card boardImmersion Tin, OSP


SMT main equipment process capability
machinescopeProcess parameters
Printing press  GKG GLSPCB printing seal50X50MM~610x510mm
Printing accuracy±0.018mm
Frame size420×520mm—737×737mm
PCB  thickness range0.4-6mm
All-in-one machine for stacking boardPCB conveying seal50X50MM~400x360mm
Unwinding machinePCB conveying seal50X50MM~400x360mm
YAMAHA YSM20RWhen transferring 1 boardL50×W50mm L810×W490mm
SMD theoretical speed95,000CPH ( 0.027sec / CHIP )
Mounting range0201(mm)-45*45mm component mounting height: less than 15mm
Mounting accuracyCHIP±0.035mm  ( ±0.025mm )  Cpk  1.0  ( 3σ )
number of components140 kinds ( 8mm reel)
YAMAHA YS24When transferring 1 boardL50×W50mm L700×W460mm
SMD theoretical speed72,000CPH ( 0.05sec / CHIP )
Mounting range0201(mm)-32*mm component mounting height: 6.5MM
Mounting accuracy±0.05mm(μ+3σ) ±0.03mm(3σ)
number of components120 kinds ( 8mm reel)
YAMAHA YSM10When transferring 1 boardL50×W50mm L510×W460mm
SMD theoretical speed46000CPH ( 0.078sec / CHIP )
Mounting range0201(mm)-45*mm component mounting height: 15MM
Mounting accuracy±0.035mm (±0.025mm) Cpk  1.0 (3σ)
number of components48 types ( 8mm reel) / 15 automatic IC trays
JT TEA--1000Adjustable for each dual trackW50~270MM substrate / single track adjustable W50*W450mm
The height of components on the PCB board25MM up and down
conveyor belt speed300~2000MM/MIN
ALeader ALD7727D AOI OnlineResolution / Visual Range / SpeedOptional: 7µm/Pixel FOV: 28.62mm x 21.00mm     Standard: 15µm/Pixel FOV: 61.44mm x 45.00mm
Detection speed230ms/FOV
barcode systemAutomatic barcode recognition ( 1D or 2D code )
PCB size range50×50mm(Min) 510×300mm(Max)
1 track fixed1 track is fixed, 2 , 3 , 4 tracks can be adjusted, the minimum size between 2 and 3 tracks is 95mm , and the maximum size of 1 , 4 tracks is 700mm ;
single trackThe maximum width of the track is 550mm ; for double tracks: the maximum width of both tracks is 300mm (testable width);
PCB thickness range0.2MM ~ 5mm 
PCB top and bottom clearanceTop Side of PCB : 30 mm Bottom Side of PCB : 60 mm
SPI  Stechbarcode systemAutomatic barcode recognition ( 1D or 2D code )
PCB size range50×50mm(Min) 630×590mm(Max)
precision1µm, Height : 0.37µm
RepeatabilityLess than 1µm (4sigma)     Volume / Area : Less than 1% (4sigma)   Height : Greater than 1µm (4sigma)
FOV speed0.3s/FOV
Reference point detection time0.5sec/pcs
Maximum detection height±550µm~1200µm
Bending PCB Maximum Measurement Height±3.5MM~±5MM
Minimum pad pitch100µm ( based on a pad with a pad height of 1500µm )
Minimum measurement sizeRectangle 150µm, Round 200µm
Component height on PCB40MM up and down
PCB board thickness0.4~7MM
Shansi XRAY inspection equipment VX1800Light tube voltage130V-160KV
light tube current0.15mA
System magnification130 kV: 1500X 160 kV: 6000X
Closed tube functionClosed tube optional 90KV and 130KV, high power penetration shielding layer effect is better, detection of samples below 1 micron
Can detect samples at 70 degree angleSystem magnification up to 6000
Light pipe focus size1um-3um
Stage650mmX540mm
geometric magnification300 times
BGA detectionThe magnification is larger, the image is clearer, and it is easier to see BGA virtual soldering and tin cracks
StageX , Y , Z direction positioning can be carried out ; X- ray tube and X- ray detector direction positioning


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