Kingford focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short lead time".
The heat generated during the operation of electronic equipment makes the internal temperature of the equipment rise rapidly. If the heat is not distributed in time, the device will fail due to overheating.
The choice of surface treatment process mainly depends on the type of final assembly components; The surface treatment process will affect PCB production, assembly and final use.
The purpose of the surface treatment is to ensure good solderability or electrical properties. Since copper tends to exist in the air as an oxide and is unlikely to remain as raw copper for long periods of time, other treatments of copper are required.
When PCB size is too large, the printed line is long, the impedance increases, the anti-noise ability decreases, and the cost increases. Too small, the heat dissipation is not good, and the adjacent lines are susceptible to interference.
PCB as the support body of electronic components, its surface needs to be welded components, it requires a part of the copper layer exposed for welding. Hence the need to brush solder resistance paint.
When the copper wire on PCB board is soaked in etching liquid for a long time, it will cause some fine line backing zinc layer to be completely reacted off and separated from the substrate, that is, the copper wire falls off.
The complexity of PCB production process and process maintenance, especially in chemical wet treatment, make it difficult to prevent the surface foaming defects.
Whether gold or silver, the purpose of the process itself is to prevent oxidation, protect the pad, so that it in the subsequent welding process to ensure yield.
The quality of PCB directly affects the quality of the whole electronic products, PCB testing is a timely detection of problems, but also a necessary means to prevent more defective products to reduce losses.
The OSP acts as a barrier between the copper and the air. Simply put, it chemically grows an organic film on a clean, bare copper surface. The only function of this organic film is to ensure that the inner copper foil does not oxidize before welding.
Field observation is a practical investigation method, which is of great reference significance for the internal self-understanding and improvement of PCB manufacturers, as well as the understanding and selection of suppliers.
There are three main types of metal substrate: aluminum substrate, copper substrate, iron substrate. Iron substrate is rarely used in the market, here the focus of analysis is aluminum substrate, copper substrate.
