KINGFORD are focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short delivery period".
SMT Assembly
Bidirectional inverter module PCB assembly

Bidirectional inverter module PCB assembly

Bidirectional inverter module PCB assembly

Name: 2.2kW /110Vac high power bidirectional inverter module INV2200-BD

Maximum efficiency: 94.5%

Function: with PFC function

Performance: positive and negative charge and discharge, high reliability

Standard: RoHS Compliant

High output voltage and current accuracy: 1%

Weight: ≤2.0kg

Size: 260mm×150mm×65mm

Industrial control SMT chip processing

Industrial control SMT chip processing

Name: Industrial control SMT chip processing

Number of SMT lines: 7high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone motherboards, battery protection circuits and other difficult products

Android motherboard SMT patch processing

Android motherboard SMT patch processing

Name: Android motherboard SMT patch processing

Number of SMT lines: 7high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone motherboards, battery protection circuits and other difficult products

Bluetooth module smt patch processing

Bluetooth module smt patch processing

Name: Bluetooth module smt patch processing

Number of SMT lines: 7high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone motherboards, battery protection circuits and other difficult products

Medical motherboard SMT chip processing

Medical motherboard SMT chip processing

Name: Medical motherboard SMT chip processing

Number of SMT lines: 7high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone motherboards, battery protection circuits and other difficult products

4G communication module PCBA processing

4G communication module PCBA processing

Name: 4G communication module PCBA processing

Number of SMT lines: 7high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone motherboards, battery protection circuits and other difficult products

Industrial control board SMT processing

Industrial control board SMT processing

Name: Industrial control board SMT processing

Number of SMT lines: 7high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone motherboards, battery protection circuits and other difficult products

Notebook game graphics card SMT processing

Notebook game graphics card SMT processing

Name: Notebook game graphics card SMT processing

Number of SMT lines: 7high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone motherboards, battery protection circuits and other difficult products

4G communication module SMT patch

4G communication module SMT patch

Name: 4G communication module SMT patch

Number of SMT lines: 7high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone motherboards, battery protection circuits and other difficult products

Core motherboard PCBA control board

Core motherboard PCBA control board

Name: Core motherboard PCBA control board

Number of SMT lines: 7high-speed SMT patch supporting production lines

SMT daily production capacity: more than 15 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station

Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece

The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm

IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. It can be mounted/inserted/mixed with TFT display driver boards, mobile phone motherboards, battery protection circuits and other difficult products

ItemProcess Capability Parameter
Order Quantity≥1PC
Quality GradeIPC-A-610
Lead Time24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you.
Size50*50mm~510*460mm
Board TypeRigid PCB, Flexible PCB, metal core PCB
Min Package01005 (0.4mm*0.2mm)
Max PackageNo limit
Mounting Accuracy±0.035mm(±0.025mm)  Cpk≥1.0 (3σ)
Surface FinishLead/Lead-free HASL, Immersion gold, OPS, etc.
Assembly TypesSurface mount (SMT), Through-hole (DIP), Mixed Technology (SMT & Thru-hole)
Component SourcingTurnkey (All components sourced by PCBMay), Partial turnkey, Kitted/Consigned
BGA PackageBGA Dia. 0.14mm, BGA 0.2mm pitch
SMT Parts PresentationCut Tape, Partial reel, Reel,Tube, Tray, Laser-cut Stainless Steel
Cable AssemblyWe supply custom cables, cable assemblies, wiring looms/harnesses and power leads for various industries including automotive, security, mining, medical and entertainment.
StencilStencil with or without frame (offered free by PCBMay)
Quality InspectionVisual inspection; AOI checking; BGA placement – X-RAY checking
SMT Capacity3 Million~4 Million Soldering Pad/day
DIP Capacity100 Thousand Pins/day


Automatic solder paste printing machine

Automatic solder paste printing machine

AOI Optical Inspection

AOI Optical Inspection

SMT high-speed placement machine

SMT high-speed placement machine

Nitrogen reflow soldering

Nitrogen reflow soldering

x-ray

x-ray

Three anti-paint spraying machine

Three anti-paint spraying machine

SPI Solder Paste Thickness Tester

SPI Solder Paste Thickness Tester

Automatic wave soldering machine

Automatic wave soldering machine

first article inspection

first article inspection

KINGFORD
Why choose us?
Efficient quotation
Efficient quotation

Our complete turnkey PCB assembly service provides a 24 hour quote service for your turnkey PCB assembly order.

All-round and reliable parts supplier
All-round and reliable parts supplier

Kingford cooperates with world-renowned component suppliers to ensure that the source of electronic components is plastic and the authenticity is guaranteed.

Advanced equipment
Advanced equipment

It has 7 fully automatic SMT high-speed chip production lines, equipped with ten temperature zone nitrogen reflow ovens, online AOI, SPI, X-RAY and other equipment.

Quality assurance
Quality assurance

We have complete ISO9001, ISO13485, ISO14001, IATF 16949, UL and other system certifications, and our products meet environmental protection requirements.

KINGFORD
Our PCB&PCBA Solutions
The company has successively cooperated with more than 3,000 high-tech R&D, manufacturing and service companies around the world, with technical solutions covering medical, industrial control, artificial intelligence, Internet of Things, automotive electronics, smart home and other fields.
KINGFORD
SMT Assembly FAQ
1.What different SMT printed circuit boards can you assemble?
We can assemble the following types of single-sided and double-sided SMT printed circuit boards: Ball Grid Array (BGA), Ultra Fine Ball Grid Array (uBGA), Quad Flat Pack Lead Free (QFN), Quad Flat Pack (QFP), Small Outline Integrated Circuit (SOIC), Plastic Leaded Chip Carrier (PLCC), Package-on-Package (PoP)
2.Do you provide SMT prototype boards?

Yes, we are fully capable of handling any type of custom SMT prototyping board requirements for you.

3.What are the advantages of surface mount SMT assembly?

SMT PCBs have a wide range of advantages, the most important being that they are suitable for small size and light weight printed circuit boards.

4.What technologies are used in SMT assembly?
SMT assembly involves the following: application of solder paste, placement of components, and soldering of circuit boards using a reflow process.
5.What is SMT PCB Assembly?
Surface Mount Technology (SMT) is a method of mounting electronic components directly onto the surface of a printed circuit board.
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