Hybrid PCB Assembly

Functionality: quad transmitters, quad receivers, 

and dual observation receivers with 2 inputs each

 Bandwidth: 200 MHz receiver,

200 MHz large signal/ 450 MHz synthesis transmitter 

,and 450 MHz observation receiver

Tuning range: 650 MHz to 6 GHz

Interface: 12 Gbps JESD204B/C 1

Power consumption: 5 W 2

Multichip LO phase synchronization

DFE features: Enhanced DPD / CLGC / CFR 3

Package: 14 ×14 BGA

1. Will update to 24.33Gbps in future release

2. For 25% Rx 75% Tx, 1x Orx on, 200 MHz/450 MHz/450MHz BW, 0 dB attenuation

3. Supported on ADRV9029 whICh is coming soon

Name: FR4-based PCB substrate Assembly

Wide field of view antenna: Azimuth FOV 120°, Elevation FOV 80°

Discrete DCDC power management solution

Relaxed PCB rules: Lower manufacturing cost

– No mICro vias, only through via

– No vias on the BGA pads

Serial port for onboard QSPI flash programming

60-pin, high-density (HD) connectors for raw analog-to-digital converter (ADC) data over LVDS：Onboard CAN-FD transceiver；USB powered standalone mode of operation

Name: Huawei RRU3908 base station PCB Assembly

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station

Placement speed: chip component placement speed (at best conditions) 0.036 S/piece

The SMAllest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products

Name:mmWave Hybrid PCB Assembly

Plate：FR4-based PCB substrate

Wide field of view antenna: Azimuth FOV 120°, Elevation FOV 80°

Discrete DCDC power management solution

Relaxed PCB rules: Lower manufacturing cost

– No mICro vias, only through via

– No vias on the BGA pads

Application：60-GHz to 64-GHz mmWave sensor

• Serial port for onboard QSPI flash programming

• 60-pin, high-density (HD) connectors for raw analog-to-digital converter (ADC) data over LVDS

• Onboard CAN-FD transceiver

• USB powered standalone mode of operation

Discrete DC/DC power-management solution; onboard capability for power-consumption monitoring

Name: WARP Radio Hybrid PCB Assembly

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station

Placement speed: chip component placement speed (at best conditions) 0.036 S/piece

The SMAllest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products