Kingford focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short lead time".

Hybrid PCB Assembly

RFPD 5G Smallcell RU PCB Board assembly

RFPD 5G Smallcell RU PCB Board assembly

Functionality: quad transmitters, quad receivers, 

and dual observation receivers with 2 inputs each

 Bandwidth: 200 MHz receiver,

200 MHz large signal/ 450 MHz synthesis transmitter 

,and 450 MHz observation receiver

Tuning range: 650 MHz to 6 GHz

Interface: 12 Gbps JESD204B/C 1

Power consumption: 5 W 2

Multichip LO phase synchronization

DFE features: Enhanced DPD / CLGC / CFR 3

Package: 14 ×14 BGA

1. Will update to 24.33Gbps in future release

2. For 25% Rx 75% Tx, 1x Orx on, 200 MHz/450 MHz/450MHz BW, 0 dB attenuation

3. Supported on ADRV9029 whICh is coming soon

XWR6843 mmWave sensing device PCB Assembly

XWR6843 mmWave sensing device PCB Assembly

Name: FR4-based PCB substrate Assembly

Wide field of view antenna: Azimuth FOV 120°, Elevation FOV 80°

Discrete DCDC power management solution

Relaxed PCB rules: Lower manufacturing cost

– No mICro vias, only through via

– No vias on the BGA pads

Serial port for onboard QSPI flash programming

60-pin, high-density (HD) connectors for raw analog-to-digital converter (ADC) data over LVDS:Onboard CAN-FD transceiver;USB powered standalone mode of operation

Huawei RRU3908 base station PCB Assembly

Huawei RRU3908 base station PCB Assembly

Name: Huawei RRU3908 base station PCB Assembly

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station

Placement speed: chip component placement speed (at best conditions) 0.036 S/piece

The SMAllest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boardsflexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products


mmWave Hybrid PCB Assembly

mmWave Hybrid PCB Assembly

Name:mmWave Hybrid PCB Assembly

Plate:FR4-based PCB substrate

Wide field of view antenna: Azimuth FOV 120°, Elevation FOV 80°

Discrete DCDC power management solution

Relaxed PCB rules: Lower manufacturing cost

– No mICro vias, only through via

– No vias on the BGA pads

Application:60-GHz to 64-GHz mmWave sensor

• Serial port for onboard QSPI flash programming

• 60-pin, high-density (HD) connectors for raw analog-to-digital converter (ADC) data over LVDS

• Onboard CAN-FD transceiver

• USB powered standalone mode of operation

Discrete DC/DC power-management solution; onboard capability for power-consumption monitoring

WARP Radio Hybrid PCB Assembly

WARP Radio Hybrid PCB Assembly

Name: WARP Radio Hybrid PCB Assembly

Number of SMT lines: 7 high-speed SMT patch supporting production lines

SMT daily production capacity: more than 30 million points

Testing Equipment: X-RAY Tester, First Piece Tester, AOI AutomatIC Optical Tester, ICT Tester, BGA Rework Station

Placement speed: chip component placement speed (at best conditions) 0.036 S/piece

The SMAllest package that can be attached: 0201, the accuracy can reach ±0.04mm

Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm

IC type patch accuracy: it has a high level for mounting ultra-thin PCB boardsflexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products


SMT capacity: 19 million points/day
Testing EquipmentX-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speedChip placement speed (at best conditions) 0.036 S/piece
Mounted Component SpecificationsPasteable smallest package
Minimum device accuracy
IC type chip accuracy
Mounted PCB SpecificationsSubstrate size
Substrate thickness
throw rate1. Resistance-capacitance ratio 0.3%
2. IC type without throwing material
Board TypePOP/common board/FPC/rigid-flex board/metal substrate

DIP daily production capacity
DIP plug-in production line50000 points/day
DIP post welding production line20000 points/day
DIP test production line50000pcs PCBA/day

Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month

PCBA processing capability
projectMass processing capabilitySmall batch processing capability
Number of layers (max)2-1820-30
Plate typeFR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg SheetPTFE, PPO, PPE
Rogers,etc TeflonE-65, ect
Sheet mixing4 layers - 6 layers6th floor - 8th floor
biggest size610mm X 1100mm/
Dimensional Accuracy±0.13mm±0.10mm
Plate thickness range0.2mm--6.00mm0.2mm--8.00mm
Thickness tolerance ( t≥0.8mm)±8%±5%
Thickness tolerance (t<0.8mm)±10%±8%
Media thickness0.076mm--6.00mm0.076mm--0.100mm
Minimum line width0.10mm0.075mm
Minimum spacing0.10mm0.075mm
Outer copper thickness8.75um--175um8.75um--280um
Inner layer copper thickness17.5um--175um0.15mm--0.25mm
Drilling hole diameter (mechanical drill)0.25mm--6.00mm0.15mm--0.25mm
Hole diameter (mechanical drill)0.20mm--6.00mm0.10mm--0.20mm
Hole Tolerance (Mechanical Drill)0.05mm/
Hole tolerance (mechanical drill)0.075mm0.050mm
Laser Drilling Aperture0.10mm0.075mm
Plate thickness aperture ratio10:112:1
Solder mask typePhotosensitive green, yellow, black, purple, blue, ink/
Minimum Solder Mask Bridge Width0.10mm0.075mm
Minimum Solder Mask Isolation Ring0.05mm0.025mm
Plug hole diameter0.25mm--0.60mm0.60mm-0.80mm
Impedance tolerance±10%±5%
Surface treatment typeHot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card boardImmersion Tin, OSP
Automatic solder paste printing machine

Automatic solder paste printing machine

AOI Optical Inspection

AOI Optical Inspection

SMT high-speed placement machine

SMT high-speed placement machine

Nitrogen reflow soldering

Nitrogen reflow soldering

x-ray

x-ray

Three anti-paint spraying machine

Three anti-paint spraying machine

SPI Solder Paste Thickness Tester

SPI Solder Paste Thickness Tester

Automatic wave soldering machine

Automatic wave soldering machine

first article inspection

first article inspection

Kingford
Why choose us?
Kingford
Our PCB&PCBA Solutions

The company has successively cooperated with more than 3,000 high-tech R&D, manufacturing and service companies around the world, with technical solutions covering medical, industrial control, artificial intelligence, Internet of Things, automotive electronics, smart home and other fields.

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