Provide professional Energy Storage Module(ESM) PCB Assembly, Battery Energy Storage Systems PCBA services-kingford

Kingford focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short lead time".

Phone：+86-13410863085

Email：sales@kingfordpcb.com

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Kingford focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short lead time".

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Energy Storage Module 150W Inverter PCB Assembly

Name：Energy Storage Module 150W Inverter PCB Assembly

Base Material：Copper

Insulation Materials：Epoxy Resin

Model：Energy Storage Module PCB Assembly

PCB base：Fr-4

Voltage：DC12V

Color：Customized

Transport Package：Packed in Carton

SpecifICation：RoHS, SGS, UL

Origin：shenzhen

Production Capacity：5000PCS/Month

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Energy Storage Protection Circuit Module PCB Assembly

Name:Energy Storage Protection Circuit Module PCB assembly

Specified Types：3-10s Li-ion/Li-Polymer/LiFePO4 Battery

L-Ion/Li-Polymer Charging Voltage：12.6V-42V

LiFePO4 Charging Voltage：10.8V-36V

Max. Continuous Charging Current：150A

Maximal Continuous Discharging Current：150A

Discharge Overcurrent Protection：400±50A(Adjustable)

Colour of PCM：Green

Balance：Yes

Transport Package：AntistatIC Bag /White Box and Standard Export Cart

Specification：L230*W140*T35mm

Origin：China Guangdong

Production Capacity：500000/Month

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12V to 220v energy storage module PCB Assembly

Name：12V to 220v energy storage module PCB Assembly

Metal Coating：Silver,Copper,Gold,Tin

Mode of Production：SMT

Layers：Multilayer

Base Material：Fr4 Tg130,150,Tg170 /Aluminum

CertifICation：RoHS, ISO

Customized：Customized

Condition：New

Solder Mask Color：Black、Red、Yellow、White、Blue、Green

Testing Service：AOI+100% Electrical Test

SMT Efficiency：BGA.Qfp.Sop.Qfn.Plcc.chip

PCBA Service：One Stop Turnkey PCBA Service

Copper Thickness：1 Oz, 0.5-6oz

Supplier Type：OEM/EMS

Min. Hole Size：0.2mm

Min. Line Spacing：0.075m

Min. Line Width：0.127mm

Layer Available：1-24 Layers PCB board

Transport Package：Anti-Static Packing

Specification：can make Blind Vias+ControlLED Impedance+BGA

Origin：China

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Bidirectional inverter module PCB assembly

Name：Bidirectional inverter module PCB assembly

EffICiency: Maximum Efficiency: 94.5%

Function: with PFC function

Reliability: forward and reverse charging and discharging, high reliability

Standard: RoHS Compliant

Output voltage: high output voltage and current accuracy, better than 1%

Weight: Weight≤2.0kg

Size: 260mm×150mm×65mm

Application: outdoor portable power supply; single-phase inverter; UPS, industrial battery charge and discharge

Description: The 2.2kW high-power bidirectional inverter module INV2200-BD circuit realizes digital power factor correction (PFC), forward LLC, and reverse full-bridge SPWM technology into a two-stage topology, realizes the integration of rectification and inverter, and uses MCU at the same time Programmable control of forward and reverse charging control commands, hardware-level and software-level short-circuit protection, and pure sine wave inverter voltage.

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PCB Assembly Capability
PCB Assembly Equipment

SMT capacity: 19 million points/day
Testing Equipment	X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed	Chip placement speed (at best conditions) 0.036 S/piece
Mounted Component Specifications	Pasteable smallest package
	Minimum device accuracy
	IC type chip accuracy
Mounted PCB Specifications	Substrate size
Mounted PCB Specifications	Substrate thickness
throw rate	1. Resistance-capacitance ratio 0.3%
throw rate	2. IC type without throwing material
Board Type	POP/common board/FPC/rigid-flex board/metal substrate

DIP daily production capacity
DIP plug-in production line	50000 points/day
DIP post welding production line	20000 points/day
DIP test production line	50000pcs PCBA/day

Assembly processing capability
The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month

PCBA processing capability
project	Mass processing capability	Small batch processing capability
Number of layers (max)	2-18	20-30
Plate type	FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet	PTFE, PPO, PPE
Plate type	Rogers,etc Teflon	E-65, ect
Sheet mixing	4 layers - 6 layers	6th floor - 8th floor
biggest size	610mm X 1100mm	/
Dimensional Accuracy	±0.13mm	±0.10mm
Plate thickness range	0.2mm--6.00mm	0.2mm--8.00mm
Thickness tolerance ( t≥0.8mm)	±8%	±5%
Thickness tolerance (t＜0.8mm)	±10%	±8%
Media thickness	0.076mm--6.00mm	0.076mm--0.100mm
Minimum line width	0.10mm	0.075mm
Minimum spacing	0.10mm	0.075mm
Outer copper thickness	8.75um--175um	8.75um--280um
Inner layer copper thickness	17.5um--175um	0.15mm--0.25mm
Drilling hole diameter (mechanical drill)	0.25mm--6.00mm	0.15mm--0.25mm
Hole diameter (mechanical drill)	0.20mm--6.00mm	0.10mm--0.20mm
Hole Tolerance (Mechanical Drill)	0.05mm	/
Hole tolerance (mechanical drill)	0.075mm	0.050mm
Laser Drilling Aperture	0.10mm	0.075mm
Plate thickness aperture ratio	10：1	12：1
Solder mask type	Photosensitive green, yellow, black, purple, blue, ink	/
Minimum Solder Mask Bridge Width	0.10mm	0.075mm
Minimum Solder Mask Isolation Ring	0.05mm	0.025mm
Plug hole diameter	0.25mm--0.60mm	0.60mm-0.80mm
Impedance tolerance	±10%	±5%
Surface treatment type	Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board	Immersion Tin, OSP