- PCB Design Capabilities
|PCB Design&Layout Capabilities|
|Min.trace width:||2.5mil||Min.trace spacing||2.5mil|
|Min.Vias:||6mil(4mil laser drilling)||Max.layer||48L|
|Min.BGA spacing||0.35mm||Max.BGA Pin||3600pin|
|Max.high-speed signal||40 GBPS||Fastest delivery time||6 Hours/ Item|
|HDI Highest layer||22 L||HDI Highest layer||14 L any layer HDI|
|PCB Design&Layout lead time|
|Number of pins on the board||0-1000||Design lead time (working days)||3-5 days|
|Ultimate delivery capacity||10000Pin/7 days|
|PS: The above delivery date is the regular delivery date, and the accurate design delivery date needs to be comprehensively evaluated according to the number of components, difficulty, layers and other factors of the circuit board!|
System advanced training, from beginners to experts, there are various technical special trainings every week
High-standard confidentiality measures, signing confidentiality agreements, and all documents exporting must be approved to ensure that 100% of documents are not leaked.
With a strict quality system process and a strict review system, we have zero error rate quality requirements for PCB design.
PCB design team with an average of more than 12 years of work experience, with complete design software, such as Cadence Allegro\ORCAD, Mentor WG\PADS, etc.
Insulation: Since the halogen is replaced by P or N, the polarity of the epoxy molecular bonds is reduced, which improves the insulation resistance and breakdown voltage.
Water absorption: Due to the relatively low electrons of N and P in the nitrogen-phosphorus-oxygen reduction resin, the probability of forming hydrogen bonds with hydrogen atoms in water is lower than that of halogens. The water absorption rate of halogen-free PCB is lower than that of conventional boards, which affects reliability to a certain extent.
Thermal stability: The nitrogen and phosphorus content in halogen-free PCB is higher than that of ordinary board, so monomer molecular weight and Tg value increase.