Kingford focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short lead time".

HDI PCB Design

Communication high-speed signal PCBA design

Communication high-speed signal PCBA design

Name: CommunICation high-speed signal PCBA Design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanical aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

Arbitrary Interconnect HDI PCBA Design

Arbitrary Interconnect HDI PCBA Design

Name: Arbitrary Interconnect HDI PCBA Design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

10-layer second-order HDI PCBA design

10-layer second-order HDI PCBA design

Name: 10-layer second-order HDI PCBA Design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

16-layer two-stage high-precision PCB design

16-layer two-stage high-precision PCB design

Name: 16-layer two-stage high-precision PCB design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

8-layer second-order HDI PCBA design

8-layer second-order HDI PCBA design

Name: 8-layer second-order HDI PCBA Design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

Six-layer HDI PCBA design and production

Six-layer HDI PCBA design and production

Name: TG180 High Density Interconnector PCBA Design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

Automation Equipment HDI PCBA Design

Automation Equipment HDI PCBA Design

Name: Automation Equipment HDI PCBA Design

Sheet: IT180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Surface treatment: rosin spray tin electric gold, anti-oxidation, chEMIcal gold, carbon oil

Service: Provide OEM service

 4-layer HDI switch circuit board design

4-layer HDI switch circuit board design

Name: 4-layer HDI switch circuit board design

Sheet: IT180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Surface treatment: rosin spray tin electric gold, anti-oxidation, chEMIcal gold, carbon oil

Service: Provide OEM service

PCB Design&Layout Capabilities
Min.trace width:2.5milMin.trace spacing2.5mil
Min.Vias:6mil(4mil laser drilling)Max.layer48L
Min.BGA spacing0.35mmMax.BGA Pin3600pin
Max.high-speed signal40 GBPSFastest delivery time6 Hours/ Item
HDI Highest layer22 LHDI Highest layer14 L any layer HDI

PCB Design&Layout lead time
Number of pins on the board0-1000Design lead time (working days)3-5 days
2000-30005-8 days
4000-50008-12 days
6000-700012-15 days
8000-900015-18 days
10000-1200018-20 days
13000-1500020-22 days
16000-1800022-25 days
18000-2000025-30 days
Ultimate delivery capacity10000Pin/7 days
PS: The above delivery date is the regular delivery date, and the accurate design delivery date needs to be comprehensively evaluated according to the number of components, difficulty, layers and other factors of the circuit board!
Kingford
Why choose us?
Efficient Design
Efficient Design

Parallel design to shorten lead time; conventional can shorten PCB design time by 50%

High standards of confidentiality
High standards of confidentiality

High-standard confidentiality measures, signing confidentiality agreements, and all documents exporting must be approved to ensure that 100% of documents are not leaked.

difficult design
difficult design

The maximum design scale is 90000pin, which can provide HDI/Any layer PCB design, 3D PCB design, RF design, 56G high-speed design, etc.

Professional design team
Professional design team

PCB design team with an average of more than 12 years of work experience, with complete design software, such as Cadence Allegro\ORCAD, Mentor WG\PADS, etc.

Kingford
Our PCB&PCBA Solutions

The company has successively cooperated with more than 3,000 high-tech R&D, manufacturing and service companies around the world, with technical solutions covering medical, industrial control, artificial intelligence, Internet of Things, automotive electronics, smart home and other fields.

Kingford
HDI PCB Design FAQ
1.Why is DFM inspection so important in HDI PCB design?

As products are miniaturized, many designs push the physical limits of PCB manufacturability. In this context, the importance of DFM inspection is increasing.

Multilayer PCB Design FAQ

2.What does DFM need to check after HDI PCB design?

Some DFM problems include: problems due to copper/solder mask debris on the plane, problems due to no gap pads on the plane, problems due to insufficient annular rings, problems due to copper being too close to the edge of the board.

3.What is HDI PCB design?

HDI PCB Design High Density Interconnector PCB Design. Circuit boards with higher wiring density per unit area compared to traditional circuit boards are called HDI PCBs.

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