HDI PCB Design

16-layer two-stage high-precision PCB design

Name: 16-layer two-stage high-precision PCB design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

Designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanical aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

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Product Details Data Sheet

A 16-layer stack has 16 layers of routing and is typically used for high-density designs. In EDA applications, routing techniques often fail to route the design. That's why manufacturers add multiple layers.

 16-layer PCB fabrication, made of 16 layers, made of halogen-free materials, aluminum, CEM and FR

 Plate thickness extended to 7 mm

 Maximum finished board size is 500 x 500 mm thick

 Finishes are also halogen-free gold and silver plated