Kingford focus on the high-quality PCBA order demand of "Multiple varieties, medium and small batch, and short lead time".

High speed PCB Design

High Frequency High Speed PCB Design

High Frequency High Speed PCB Design

Name: High Frequency High Speed PCB Design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

artificial intelligence circuit board design

artificial intelligence circuit board design

Name: artificial intelligence circuit board design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

5G communication circuit board design

5G communication circuit board design

Name: 5G communication circuit board design

Plate:RO4003C+370HR+RO4450F

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

 Communication terminal circuit board design

Communication terminal circuit board design

Name: Communication terminal circuit board design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

High Speed Server Backplane PCB Design

High Speed Server Backplane PCB Design

Name: High Speed Server Backplane PCB Design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

14-layer 25G high-speed HDI PCB design

14-layer 25G high-speed HDI PCB design

Name: 14-layer 25G high-speed HDI PCB design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

High-speed and high-density PCBA design

High-speed and high-density PCBA design

Name: High-speed and high-density PCBA Design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

12-layer automotive high-speed backplane design

12-layer automotive high-speed backplane design

Name: 12-layer automotive high-speed backplane design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

Designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanICal aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

PCB Design&Layout Capabilities
Min.trace width:2.5milMin.trace spacing2.5mil
Min.Vias:6mil(4mil laser drilling)Max.layer48L
Min.BGA spacing0.35mmMax.BGA Pin3600pin
Max.high-speed signal40 GBPSFastest delivery time6 Hours/ Item
HDI Highest layer22 LHDI Highest layer14 L any layer HDI

PCB Design&Layout lead time
Number of pins on the board0-1000Design lead time (working days)3-5 days
2000-30005-8 days
4000-50008-12 days
6000-700012-15 days
8000-900015-18 days
10000-1200018-20 days
13000-1500020-22 days
16000-1800022-25 days
18000-2000025-30 days
Ultimate delivery capacity10000Pin/7 days
PS: The above delivery date is the regular delivery date, and the accurate design delivery date needs to be comprehensively evaluated according to the number of components, difficulty, layers and other factors of the circuit board!
Kingford
Why choose us?
Efficient Design
Efficient Design

Parallel design to shorten lead time; conventional can shorten PCB design time by 50%

High standards of confidentiality
High standards of confidentiality

High-standard confidentiality measures, signing confidentiality agreements, and all documents exporting must be approved to ensure that 100% of documents are not leaked.

difficult design
difficult design

The maximum design scale is 90000pin, which can provide HDI/Any layer PCB design, 3D PCB design, RF design, 56G high-speed design, etc.

Professional design team
Professional design team

PCB design team with an average of more than 12 years of work experience, with complete design software, such as Cadence Allegro\ORCAD, Mentor WG\PADS, etc.

Kingford
Our PCB&PCBA Solutions

The company has successively cooperated with more than 3,000 high-tech R&D, manufacturing and service companies around the world, with technical solutions covering medical, industrial control, artificial intelligence, Internet of Things, automotive electronics, smart home and other fields.

Kingford
Frequently Asked Questions about High Speed PCB Design
1.How can I get a quick quote for a high-speed PCB design?
To get a quote for high-speed PCB design, please provide all specifications and requirements for high-speed PCB design and we will get back to you as soon as possible. If you have any urgent needs, you can also contact us at sales@kingfordpcb.com.
2.Do you also provide PCB manufacturing and PCB assembly services?
Yes, we are fully capable of providing PCB manufacturing and PCB assembly capabilities. We have a factory of 50,000 square meters. You can contact us if you need it.
3.What is your lead time for high-speed PCB design?
We know the importance of time, so we process standard PCB designs in a timely manner when we receive customer information.
4.What is High Speed PCB Design?
High-speed PCB design refers to any design where signal integrity begins to be affected by the physical properties of the board, such as layout, packaging, layer stacking, interconnects, etc.
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