HDI PCB Design

Arbitrary Interconnect HDI PCBA Design

Name: Arbitrary Interconnect HDI PCBA Design

Plate: TG170 /TG180, F4BM, FR4, FR1-4, etc.

Designable layers: 1-32 layers

Minimum line width and line spacing: 3mil

Minimum laser aperture: 4mil

Minimum mechanical aperture: 8mil

Copper foil thickness: 18-175цm (standard: 18цm35цm70цm)

Peel strength: 1.25N/mm

Minimum punching hole diameter: single side: 0.9mm/35mil

Minimum hole diameter: 0.25mm/10mil

Aperture tolerance: ≤φ0.8mm±0.05mm

Hole tolerance: ±0.05mm

Hole wall copper thickness: double-sided/multi-layer: ≥2um/0.8mil

Hole resistance: double-sided/multi-layer: ≤300цΩ

Minimum line width: 0.127mm/5mil

Minimum pitch: 0.127mm/5mil

Screen printing color: black, white, red, green, etc.

Surface treatment: lead/lead-free tin spray, ENIG, silver, OSP

Service: Provide OEM service

Certificate: ISO9001.ROSH.UL

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Product Details Data Sheet

Any Layer HDI PCB: This is the most complex HDI PCB design structure, where all layers are high-density interconnect layers, allowing free interconnection of conductors on any layer of the PCB with the copper-filled stacked microvia structure. This structure provides a reliable interconnect solution for highly complex, high pin-count devices, such as CPU and GPU chips used in handheld and mobile devices, while yielding excellent electrical characteristics.