SMT patch production process
SMT basic process elements include: screen printing, mounting (curing), reflow soldering, cleaning, ...
SMT basic process elements include: screen printing, mounting (curing), reflow soldering, cleaning, ...
Factors affecting the quality of BGA patch assembly: 1. Feasibility of BGA pad design, 2. The throug...
Aluminum substrate and glass fiber plate difference and applicationFirst, glass fiber board (FR4, si...
Application scope: SMT, LED, BGA, CSP flip chip testing, semiconductor, packaging components, lithiu...
Common PCB welding pad over wave soldering defects have the following points: (1) board surface dirt...
In the dispensing process, the technical parameters of the patch glue and the dispensing machine can...
The establishment of more and more circuit board recycling plants, to a large number of waste circui...
A perfect PCB board not only needs to do the component selection and setting is reasonable, but also...
10 advantages of soft PCB: flexibility, reduce volume, reduce weight, consistency of assembly, incre...
The simplest multilayer soft PCB is a three-layer soft PCB formed by two layers of copper shielding ...
In the SMT process of the PCB manufacturer, the solder paste printing, the operation of the SMT mach...
The rapid development and popularization of SMT processing has played a unique role in promoting the...