Name: 10-layer immersion gold PCB

Layers: 10 layers

Material: FR4 High TG

Finished plate thickness: 1.6mm

Finished copper thickness: Immersion Gold (ENIG)

Finished Copper Thickness: 1/1/1/1/1/1/1/1/1/1 oz

Special Process:

Minimum line width 3.5mil

Hole wall thickness 25um

Name: Small BGA circuit board PCB

Layers: 4 layers

PCB Material: FR4 TG170

PCB thickness: 1.6mm

Surface treatment: Immersion Gold ENIG(Gold thickness 2u”)

Finished Copper Thickness: 1/1/1/1 OZ

Solder Mask Ink: Green, Sun PSR-4000

Special Process:

Minimum line width and line spacing: 0.07/0.09mm

BGA pad: 0.25 mm

Name: Immersion Gold Plate

Layers: 4 layers

Material: FR4

Finished plate thickness: 1.6mm

Surface treatment: Immersion Gold (ENIG)

Finished Copper Thickness: 1/1/1/1 oz inside and outside

Name: Small BGA circuit board

Material: FR4 High TG

Finished plate thickness: 1.6mm

Surface treatment: Immersion Gold (ENIG)

Finished Copper Thickness: 1/1 oz inside and outside

Special Process:

BGA pad 0.1mm

Name: Green Oil PCB

Layers: 2 layers

Material: FR4 TG150

Finished plate thickness: 1.6mm

Surface treatment: Immersion Gold (ENIG)

Finished Copper Thickness: 1/1 oz inside and outside

Name: 6-layer blue oil immersion gold plate

Layers: 6 layers

Material: FR4 TG170

Finished plate thickness: 1.6mm

Surface treatment: Immersion Gold (ENIG)

Finished Copper Thickness: 1/1/1/1/1/1 oz inside and outside

Name: 6-layer black immersion gold PCB

Layers: 6 layers

Material: FR4 TG170

Finished plate thickness: 1.6mm

Finished copper thickness: Immersion Gold (ENIG)

Finished copper thickness: inner and outer layers 1/1/1/1/1/1 OZ

Name: 2 Layers FR4 PCB

Layers: 2 layers

Material: FR4

Finished plate thickness: 1.6mm

Finished copper thickness: Immersion Gold (ENIG)

Finished Copper Thickness: 1/1 oz inside and outside