Small BGA Rigid Printed Circuit Boards

The full name of BGA is Ball Grid Array (PCB with ball grid array structure), which is a pin packaging method for large components. The difference is the "one-degree space" single-row pins listed around, such as gull-wing extension feet, flat extension feet, or J-shaped feet retracted to the abdominal bottom, etc.; change to a full array or partial array of the abdominal bottom, The distribution of solder balls with two-dimensional space area is adopted as a welding and interconnection tool for the chip package to the circuit board. It has the characteristics of small package area, increased function, increased number of pins, high reliability, good electrical performance and low overall cost.