What does bga mean? The full name of BGA is Ball Grid Array (PCB with ball grid array structure), which is a packaging method in which an integrated circuit adopts an organic carrier board. It has: the package area is reduced, the function is increased, and the number of pins is increased. The PCB board can be self-centered during soldering, and it is easy to be tinned. High reliability. It has the characteristics of good electrical performance and low overall cost.
Name: Small BGA circuit board
Material: FR4 High TG
Finished plate thickness: 1.6mm
Surface treatment: Immersion Gold (ENIG)
Finished Copper Thickness: 1/1 oz inside and outside
BGA pad 0.1mm