10-layer Rigid immersion gold PCB

Name: 10-layer immersion gold PCB

Layers: 10 layers

Material: FR4 High TG

Finished plate thickness: 1.6mm

Finished copper thickness: Immersion Gold (ENIG)

Finished Copper Thickness: 1/1/1/1/1/1/1/1/1/1 oz

Special Process:

Minimum line width 3.5mil

Hole wall thickness 25um

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Product Details Data Sheet

Immersion gold plate is bright in color, good in color and good in appearance;

The crystal structure formed by immersion gold is easier to weld than other surface treatments, and can have better performance and ensure quality;

Because the immersion gold board only has nickel gold on the pad, it will not affect the signal, because the transmission of the signal in the skin effect is in the copper layer.

The metal properties of gold are relatively stable, the crystal structure is more compact, and the oxidation reaction is not easy to occur.

Because the immersion gold board only has nickel-gold on the pad, the combination of the solder mask on the line and the copper layer is stronger, and it is not easy to cause micro-short circuit.

The project will not affect the spacing when compensating.

The stress of the immersion gold plate is easier to control.