Deformation caused in the process of PCB board processing
PCB deformation causes can be divided into thermal stress and mechanical stress. The thermal stress ...
PCB deformation causes can be divided into thermal stress and mechanical stress. The thermal stress ...
In any switching power supply design, the physical design of the PCB board is the last link. If the ...
The installation and welding of surface assembly parts are mainly divided into two basic technology ...
SMT patch factory control method of temperature and humidity sensitive elements: 1, environmental co...
PCBA is one of the basic components of electronic components, PCB it through surface assembly techno...
SMT patch processing solder paste need to pay attention to: 1, constant temperature: 2, delivery: 3,...
The physical characteristics of flux refer to melting point, surface tension, viscosity, mixing and ...
The basic process composition of SMT patch processing includes: screen printing (or dispensing), mou...
Eliminate tin bead operation as far as possible not through direct removal of tin bead, in the produ...
The main adverse phenomena in the solder paste printing process of SMT patch processing are as follo...
Analysis of the causes of short-circuit defects: 1, the solder paste collapse 2, the bottom surface ...
Soft and hard combination board is considered appropriate and the use of rigid (FR4) materials and f...