Four methods of proofing aluminum substrate
Four proofing methods of aluminum substrate: one, photographic material proofing method, two, mechan...
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Reasons for indented design of GND layer and power layer in multi-layer PCB design
Only under certain conditions can the 20H principle have obvious effects. 1. The power plane shall b...
PCBA processing welding resistance film common causes of bad
Common bad reasons for PCBA welding resistance film processing :1. Welding pad and through hole conn...
What is the meaning of "false eight layers" in PCB design?
The difference between them is that the core is thinner, the pp sheets of one or two layers and five...
PCB design requirements for screen printing design
The characteristics of the gold process: the copper on the circuit board is mainly copper, copper so...
Common wiring rules for PCB design
The function of PCB design discharge teeth: in surge testing or ESD testing, the two ends of the com...
PCB process edge function, production method and design requirements
The role of PCB process edge: process edge is the part added on both sides or four sides of PCB boar...
Analysis of common bad causes of PCB board making
PCB board common bad reasons: 1, short circuit, 2, open circuit, 3, PCB board dark and granular cont...
PCBA processing lecture hall: the common heat dissipation of circuit board
Common heat dissipation mode of circuit board: 1, high heating device plus radiator, heat conduction...
Soft and hard PCB design points
Soft and hard combined board PCB design points: 1, flexible area line design requirements, 2, dimens...
PCB board design of the 8 basic principles
The application of wave-crest welding technology and reflow welding technology are completely differ...
Solder paste printing quality process parameters
When printing plate is printing solder paste, there is a certain restrictive relationship between sc...
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