Taking the car as an example, Pan Zhengqiang further explained: "In the past, the traditional PCB was used in the car, with the increase of automotive electronic parts, the information conveyed between these electronic parts must be processed, analyz...
"Highly integrated miniaturization and modularity are the technical requirements for the development of downstream electronic products, and also the general trend of printed circuit board (PCB) to fully support the development of the electronics indu...
Right-angle PCB board is easy to produce a card during transmission, so when designing PCB board, it is necessary to do arc Angle processing on the board frame, and determine the radius of arc Angle according to the size of the PCB board.
The synchronous mode is to send two PCBS of the same size into the mounting area synchronously by the double track for mounting, and the asynchronous mode is to send PCBS of different sizes to the mounting area respectively.
SMT increases the PCB layout density, reduces the number of holes, decreases the area, and reduces the number of PCB layers with the same function, which reduces the manufacturing cost of PCB.
Chinese called chip components) installed on the surface of the Printed Circuit Board (PCB) or other substrate surface, by reflow welding or dip welding and other methods to weld the circuit assembly technology.
Printed circuit boards are an integral part of today's IT products. We found that a large number of PCB manufacturers could not stably discharge according to the standards, causing serious pollution to local rivers, soil and offshore waters.
The environmentalist's Institute of Public and Environmental Affairs, together with environmental groups such as Friends of Nature and the Dalman Institute for Environmental Studies, recently conducted a study on heavy metal emissions from the IT industry
Once encountered because of the poor environment, the dust inside the display is thick, and when the weather turns tide, the circuit board is caused by short circuit ignition and damage to the display.
according to the storage time of PCB and components and the degree of surface oxidation to select the solder paste activity.
Physical changes in the fibre-forming layers of stained glass, such as separation between layers.However, this situation is not a poor solder joint, but the substrate is too hot, reduce the preheating and solder temperature or increase the substrate trave
the device on the same printed circuit board should be arranged as far as possible according to the size of its heat and the degree of heat dissipation, small heat or poor heat resistance devices (such as small signal transistors, small-scale integrated c
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