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Industry news

Industry news

Four suggestions for PCB design from the point of view of drawing board
18Jun
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Four suggestions for PCB design from the point of view of drawing board

t present, in PCBA processing, the introduction of advanced testing equipment for quality control of the production process. In the process of reflow welding, AOI testing equipment is generally used for quality control.Can provide the smallest package 020

Why can't the signal line be changed multiple times in high-speed PCB design?
18Jun
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Why can't the signal line be changed multiple times in high-speed PCB design?

Our conclusion above is that it's better to go through a bigger hole. At this point, we need to introduce you to two formulas. One is the calculation formula of the parasitic capacitance through the hole: C=1.41εTD2/ (D1-D) The other is the calculation fo

SMT proofing small batch processing price is high reasons
18Jun
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SMT proofing small batch processing price is high reasons

In addition to labor costs can not be compressed, production efficiency will also be seriously reduced, SMT proofing small batch processing due to a small amount of production line just started to stop, which undoubtedly has a great impact on production e

The power supply circuit is an important
18Jun
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The power supply circuit is an important

Switching power supply is to use the circuit to control the switching tube for high-speed on-off and cut-off, generate PWM waveform, through the inductor and the continuous current diode, the use of electromagnetic conversion of the way to regulate voltag

What does a multi-layer PCB look like? High-end PCB board design process
18Jun
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What does a multi-layer PCB look like? High-end PCB board design process

Layout engineers think about it! No longer afraid of not painting!Think about purchasing want to cry, more than 10 times more expensive than ordinary through hole plate! Therefore, only products like the iPhone are willing to use. Other phone brands, no o

PCB Lecture Hall: The difference between aluminum substrate and FR4 board
18Jun
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PCB Lecture Hall: The difference between aluminum substrate and FR4 board

Electromagnetic shielding: In order to ensure the performance of the circuit, some components in electronic products need to prevent radiation and interference of electromagnetic waves. The aluminum substrate can be used as a shielding plate to shield ele

High Speed PCB design Ten tips for PCB lamination design
18Jun
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High Speed PCB design Ten tips for PCB lamination design

The classic PCB laminated design is almost all even layers, rather than odd layers. Even layers of printed circuit boards have cost advantages, and even layers can avoid board warping more than odd layers.

The debugging procedure and method of PCBA machining
18Jun
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The debugging procedure and method of PCBA machining

Firstly, the overcurrent protection current is preset, and then the voltage value of the regulated power supply is gradually increased, and the input current, input voltage and output voltage are monitored. If there are no problems such as over-current pr

PCB design layout constraints
18Jun
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PCB design layout constraints

The layout of the components should be convenient for signal flow, so that the signal is as consistent as possible. In most cases, the flow direction of the signal is arranged from left to right or from top to bottom, and the components directly connected

The whole process of PCB PCBA processing is introduced
18Jun
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The whole process of PCB PCBA processing is introduced

After welding parts to use the soldering iron and tin wire, welding will be maintained at a high temperature of the soldering iron contact the part foot to solder, until the temperature rises enough to melt the tin wire temperature, and then add the tin w

What is the difference between aluminum substrate and FR4 plate?
18Jun
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What is the difference between aluminum substrate and FR4 plate?

In order to ensure the performance of the circuit, some components in the electronic product need to prevent the radiation and interference of electromagnetic waves. The aluminum substrate can be used as a shielding plate to shield electromagnetic waves

Reasons for internal shrinkage design of GND layer and power layer in multi-layer PCB design
18Jun
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Reasons for internal shrinkage design of GND layer and power layer in multi-layer PCB design

the power plane should be inside the PCB, and the upper and lower layers adjacent to him are 0V planes, and the distance between the two 0V flat faces should be at least 20 times the distance between them and the power plane.

Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.