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PCB Lecture Hall: The difference between aluminum substrate and FR4 board
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PCB Lecture Hall: The difference between aluminum substrate and FR4 board

Aluminum substrate and FR4 board are two common plates in PCB board, aluminum substrate is commonly used as LED lamp board, so what is the difference between aluminum substrate and FR4 board?

The basic structure of the two plates is different in different main features. Compare the main characteristics of aluminum substrate and FR-4 plate: Compared with the heat dissipation of aluminum substrate and FR-4 plate and the heat resistance of the substrate: the substrate is aluminum substrate, and the FR-4 plate is transistor PCB, due to the different heat dissipation of the substrate, the test data of the working temperature rise are different.

Performance: The comparison of wire (copper wire) and fuse current on different substrate materials, from the comparison of aluminum substrate and FR-4 plate, due to the high heat dissipation of the metal substrate, the conduction is significantly improved, which explains the high heat dissipation characteristics of the aluminum substrate from another Angle. The heat dissipation of aluminum substrate is related to its insulating layer thickness and thermal conductivity. The thinner the insulation layer, the higher the thermal conductivity of the aluminum substrate (but the lower the pressure resistance).

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Machinability: Aluminum substrate has high mechanical strength and toughness, superior to FR-4 plate. For this purpose, a large-area printed board can be made on an aluminum substrate, on which large components can be installed.

Electromagnetic shielding: In order to ensure the performance of the circuit, some components in electronic products need to prevent radiation and interference of electromagnetic waves. The aluminum substrate can be used as a shielding plate to shield electromagnetic waves.

Coefficient of expansion: Due to the thermal expansion of FR-4 in general, and the thermal expansion of plate thickness in particular, the quality of metallized holes and lines is affected. The main reason is that the thermal expansion coefficient of the thickness of the copper in the raw material is 17 * 106cm/cm-C, and the FR-4 plate is 110 * 106cm/cm-C, and the difference is large, which is easy to produce heated substrate expansion and the change of the copper wire and the damage of the metal hole rupture on the reliability of the product. The thermal expansion coefficient of aluminum substrate is 50×106cm/cm-C, which is smaller than that of ordinary FR-4 plate and close to that of copper foil. This is conducive to ensuring the quality and reliability of the printed circuit board.

The application circuit is different, the application field is different, FR-4 board is suitable for general circuit design and ordinary electronic products.

PCB board advantages

Energy production from 2 layers to 14 layers, 14-22 layers can be proofing production.

Minimum line width/spacing: 3mil/3milBGA Spacing: 0.20MM Minimum aperture: 0.1mm610mmX1200mm

Ink: Japan Tamura, Taiyo, Fudoken;

FR4: Shengyi, Kingboard, Haigang, Hongren, Guoji, Hezheng, Nanya, (S1130/S1141/S1170),Tg130℃/ Tg170℃ T g180℃ and other high TG plates)

High frequency board: Rogers, Taconic, ARLLON; Surface process: spray tin, lead-free spray tin, sinking gold, full plate gold plating, plug gold plating, full plate thick gold, chemical sinking tin (silver), anti-oxidation (OSP) blue glue, carbon oil

kinhford Electronics is a circuit board manufacturer specializing in printed circuit board manufacturing, 20 years of focus on single, double sided, multi-layer circuit board production. Can provide FR4 hard board, FPC soft board, HDI board, metal substrate PCB proofing and mass production services.

Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.