Wiring is the most important process in PCB design. This will directly affect the performance of PCB board. In the process of PCB design, wiring generally has such three levels of division: the first is the cloth, the most basic requirements of PCB design
High speed digital circuit analysis generally only deals with multilayer PCB with complete plane layer. 2D field extraction analysis is used to consider only signal reflux in adjacent planes, and the hole is only treated as R-L-C of a lumped parameter.
Specific steps :1. Clean and fix the PCB circuit board. 2. Tin the pad on the edge of the IC pin drawing side. 3. Fix the PCB design position. 4. Check whether the pin position is correct
Single-side assembly process: incoming material detection - screen welding paste - patch - drying - reflow welding - cleaning - detection - maintenance
The key to the success or failure of RF circuit PCB design is how to reduce the circuit radiation, so as to improve the anti-interference ability, but in the actual layout and routing of some problems are in conflict with each other, so how to find a comp
For the signal transmission between the integrated blocks on a printed circuit board, the situation of Td Trd should be avoided. The larger the printed circuit board, the less fast the system speed
For the signal transmission between the integrated blocks on a printed circuit board, the situation of Td Trd should be avoided. The larger the printed circuit board, the less fast the system speed
For the research and development of switching power supply, PCB design occupies a very important position. A poor PCB, poor EMC performance, output noise, weak anti-interference ability, even the basic function has defects.
DRC should always be done when manually adjusting because sometimes some lines break. Each wiring layer can be printed out separately to facilitate rewiring.
Characteristic impedance is related to PCB wire layer, PCB material (dielectric constant), wire width, distance between wire and plane and other factors, and has nothing to do with wire length.
ESD sensitive circuits should be placed near the center of the circuit, so that other circuits can provide some shielding for them.
The power circuit and control signal circuit components need to be connected to different ground layers, which are generally connected through a single point.
Telegram
