With the rapid development of high-tech industries such as mobile phones, electronics, communications, and autonomous driving, the PCB circuit board industry has largely driven the continuous expansion and rapid growtothe circuit board industry, and peopl
PCBA welding processing, there are usually many requirements for the PCBA board, and the requirements must be met in order to weld.Then why does the welding process need so many requirements for the PCBA board?
The level of viscosity is of great concern to the smoothness or not of screen printing. Therefore, in the PCB ink technical documents and QC reports, the viscosity is clearly marked, indicating under what conditions, what type of viscosity testing equipme
The soft plate is also like the hard plate, and can be made of plated through holes or surface adhesive pads for through holes insertion or surface adhesive installation. The surface of the board can also be attached to a soft protective and solderproof C
It is a welding method that the welding end face of the components and the PCB welding pad are coated with paste solder and assembled together, heated until the solder is melted, and then the welding area is cooled.
Aluminum is a very attractive material with abundant resources, low cost, excellent thermal conductivity and strength. In addition, it is very environmentally friendly and can be used on most metal substrates or metal cores. Due to the advantages of econo
found a short circuit phenomenon. Take a board to cut the line (especially suitable for single/double board), after cutting the line, each part of the function block is powered separately, and gradually eliminated.
PCB production process is more complex, it involves a wide range of processes, from simple machining to complex machining, there are ordinary chemical reactions and photochemical electrochemical thermochemistry and other processes, computer-aided design C
From passive components to active components and integrated circuits, all eventually become surface mount devices (SMDS) and can be assembled by pick-up and drop devices. For a long time it was thought that all pin components could eventually be packaged
In order to make the test as high as possible failure coverage, in the design stage must pay attention to the selection of components and PCB layout, unfortunately, the actual situation is not always the case, rush to market and nervous development often
Challenge: Equipment is expected or required to maintain as uniform surface pressure as possible to improve the quality of processed products
Practice has proved that it is difficult to find each and every solder paste fouling only by sampling the printed circuit board samples. Only 100% inspection of all circuit boards can ensure greater inspection coverage, thus enabling statistical process c
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