Pay attention to the moisture-proof treatment of BGA, and pay attention to details during installation and soldering.
With the progress of technology in the 1990s, chip integration continued to improve, the number of I/O pins increased sharply, power consumption also increased, and the requirements for integrated circuit packaging were more stringent. In order to meet th
BGA component assembly1. PBGA (PLASTICBALL GRID ARRAY) plastic package BGAIts advantages are:①Good thermal matching with epoxy resin circuit board.② Solder balls participate in the formation of solder joints during reflow soldering, and the requirements f
Application of BGA Devices in Electronic ProductsThe large temperature difference △T in the chip range leads to the problem of different tin melting between rework and production, which prompts manufacturers to try to obtain the reason for simultaneous ti
BGA rework tool1.Since the temperature of the solder pins of the chip is always higher than the temperature of the overall circuit board, the unevenness of infrared heating at the bottom will cause the deformation of the circuit board, causing the solder
BGA Reliability ImpactSince flux directly affects electromigration and surface insulation resistance, cleaning is generally required after soldering, but flux cleaning at the bottom of BGA is a very tricky task, so it is recommended to use no-clean flux,
BGA solder joint defects and related acceptance criterial Select the appropriate X-ray detection systemIt is a very important task to choose an X-ray inspection system with high performance and price ratio suitable for actual production applications to me
BGA components and their assembly process(1) Visual inspectionFor package arrays such as BGA, without inspection equipment, first visually observe whether the collapse of the outermost solder joints is consistent, and then look at the chip against the lig
BGA package introduction BGA package (Ball Grid Array Package), that is, ball grid array, is a surface mount package chip used for an integrated circuit. Xiaoliu, I was a little confused at the beginning, what the hell is a ball grid array? In fact
Detailed knowledge of BGA component assembly and repairBall grid array (BGA) devices have undeniable advantages. But some problems in this technique are still for further discussion, and it cannot be realized immediately due to the difficulty of trimming
Brief introduction to the main points of SMT assembly process of BGA components FPC factory When SMT (Surface Mount Technology)/SMD (Surface Mount Device) practitioners find that QFP (Quad Flat Package) with a pitch of 0.3mm cannot be realized, the emerge
Brief introduction to the main points of SMT assembly process of BGA componentsFPC factory When SMT (Surface Mount Technology)/SMD (Surface Mount Device) practitioners find that QFP (Quad Flat Package) with a pitch of 0.3mm cannot be realized, the emergen
A pass hole is a pad with an electroplating hole that connects copper wires on one PCB layer to another. High density multilayer circuit boards may use blind or buried holes, also known as micro through holes.