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BGA component assembly

BGA component assembly1. PBGA (PLASTICBALL GRID ARRAY) plastic package BGAIts advantages are:①Good thermal matching with epoxy resin circuit board.② Solder balls participate in the formation of solder joints during reflow soldering, and the requirements f

Application of BGA Devices in Electronic Products

Application of BGA Devices in Electronic ProductsThe large temperature difference △T in the chip range leads to the problem of different tin melting between rework and production, which prompts manufacturers to try to obtain the reason for simultaneous ti

BGA rework tool

BGA rework tool1.Since the temperature of the solder pins of the chip is always higher than the temperature of the overall circuit board, the unevenness of infrared heating at the bottom will cause the deformation of the circuit board, causing the solder

BGA Reliability Impact

BGA Reliability ImpactSince flux directly affects electromigration and surface insulation resistance, cleaning is generally required after soldering, but flux cleaning at the bottom of BGA is a very tricky task, so it is recommended to use no-clean flux,

BGA solder joint defects and related acceptance criteria

BGA solder joint defects and related acceptance criterial Select the appropriate X-ray detection systemIt is a very important task to choose an X-ray inspection system with high performance and price ratio suitable for actual production applications to me

BGA components and their assembly process

BGA components and their assembly process(1) Visual inspectionFor package arrays such as BGA, without inspection equipment, first visually observe whether the collapse of the outermost solder joints is consistent, and then look at the chip against the lig

BGA package introduction

BGA package introduction BGA package (Ball Grid Array Package), that is, ball grid array, is a surface mount package chip used for an integrated circuit. Xiaoliu, I was a little confused at the beginning, what the hell is a ball grid array? In fact

Detailed knowledge of BGA component assembly and repair

Detailed knowledge of BGA component assembly and repairBall grid array (BGA) devices have undeniable advantages. But some problems in this technique are still for further discussion, and it cannot be realized immediately due to the difficulty of trimming

Brief introduction to the main points of SMT assembly process of BGA components FPC factory When SMT (Surface Mount Technology)/SMD (Surface Mount Device) practitioners find that QFP (Quad Flat Package) with a pitch of 0.3mm cannot be realized, the emerge

Brief introduction to the main points of SMT assembly process of BGA componentsFPC factory When SMT (Surface Mount Technology)/SMD (Surface Mount Device) practitioners find that QFP (Quad Flat Package) with a pitch of 0.3mm cannot be realized, the emergen

How to use BGA signal routing technology efficiently in PCB design

A pass hole is a pad with an electroplating hole that connects copper wires on one PCB layer to another. High density multilayer circuit boards may use blind or buried holes, also known as micro through holes.

PCB design company briefly describes the basic requirements of BGA pad design

SMT SMT processing technology has the advantages of: first, high reliability, strong vibration resistance, second, small size of electronic products, high assembly density, third, high frequency characteristics, reliable performance, four, improve product

Circuit board tips: How to strengthen PCB circuit board BGA prevent cracking

The deformation of the circuit board (PCBA board) usually comes from the rapid temperature rise and rapid temperature drop (thermal expansion and cold contraction) caused by Reflow。

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