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BGA

PCB design company briefly describes the basic requirements of BGA pad design

SMT SMT processing technology has the advantages of: first, high reliability, strong vibration resistance, second, small size of electronic products, high assembly density, third, high frequency characteristics, reliable performance, four, improve product

Circuit board tips: How to strengthen PCB circuit board BGA prevent cracking

The deformation of the circuit board (PCBA board) usually comes from the rapid temperature rise and rapid temperature drop (thermal expansion and cold contraction) caused by Reflow。

What is BGA welding

As the function requirement of electronic products is higher and higher, the volume requirement is smaller and smaller. In order to meet this need, the welding ball array packaging technology appears.

How to rework BGA and CSP components?

Take a look at BAG difficult chip repair process, requirements for equipment, personnel: 1, rework requirements for process equipment, 2, components of the temperature requirements, 3, components compatibility, 4, temperature difference Settings, 5, tempe

How does SMT plant clean PCB after surface mounting and welding

Significance of PCB cleaning after surface mounting welding: 1. PCB cleaning after surface mounting welding can prevent the occurrence of electrical defects. 2. PCB cleaning after surface mounting and welding can eliminate corrosive substances. 3. The PCB

How to judge the welding quality of BGA slices

Virtual welding is a very common line fault, one is in the process of circuit board production, caused by improper production technology, when the unstable state; The other is that after long-term use of electrical appliances, some of the more serious hea

Why do smt factories use the packaging process of BGA patches?

Customers will according to their actual needs to their own trusted electronic processing plant orders, and put forward specific requirements. The processing plant will evaluate its capacity to see if it can fulfill the order.

What are the methods for welding BGA patches?

The functional design requirements of electronic products are higher and higher, but students' requirements for volume are smaller and smaller. This requires the IC chip size to be smaller and smaller, the degree of complexity and enterprises continue to

BGA welding joint mixed process type fracture

A total of four BGA were dyed. After the BGA was pulled apart, it could be seen that most of the solder joints were pulled apart from the joint of PCB pad and substrate, and some were pulled apart from the side of pad, but there were holes.

Surface mount for mixed assembly of lead and lead-free BGA

Surface mount for mixed assembly of lead and lead-free BGA1 IntroductionThis SMT lead-free process has been widely used. However, the lead process is still used in military electronics manufacturing, but these components cannot be purchased with lead Lead

Top level PCB layout recommendations for BGA packaging

PCB processing factory explains the top PCB layout suggestions of BGA packaging, and the latest development of component packaging technology

BGA storage, SMT patch or through-hole insertion technology

Kingford is a PCB company engaged in the production and assembly of circuit boards. We not only sell PCBA, but also have many strategies related to PCB design and PCB proofing. Next, let me introduce you to some matters related to PCB.

Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.