This layer of organic film can make the circuit board before welding to ensure that the inner layer of copper foil will not be oxidized, welding, once heated, this layer of film will evaporate, solder can solder the copper wire and components togethe
It is a welding method that the welding end face of the components and the PCB welding pad are coated with paste solder and assembled together, heated until the solder is melted, and then the welding area is cooled.
PCB processing processCircuit design skills PCB design process The general PCB basic design process is as follows: preliminary preparation -> PCB structure design -> PCB layout -> wiring -> wiring optimization and silk screen -> network and DRC inspection
PCB board appearance should be smooth and flat, not warped or uneven. The appearance of PCB circuit board is usually rectangular, and the right-angle PCB board is easy to produce cards when transferring, so in the design of PCB board, to do arc Angle proc
The drilling process can be completed by inputting the drilling coordinate program in the PCB file on the drilling machine and adjusting the corresponding drilling speed. In the via process, drilling accuracy, position deviation and bit fracture must be m
At present, PCB board manufacturers generally adjust PCB prices according to different payment methods, with a range of 5%-10%, which also causes the difference in price.
The relevant design elements constituting the PCB shall be described in the design drawing. Appearance should be represented by Mechanical 1 layer (priority) or Keep out layer.
A tin or lead tin resist covering the top of the line extends to both sides, forming a "rim" that covers a small portion of the sensitive film underneath the "rim".
In the era of industrialization surplus, circuit board manufacturers in particular, choose a suitable circuit board manufacturers is very important!
PCB production is divided into: layout → core board production → inner layer layout transfer → drilling and inspection → lamination → drilling → copper chemical precipitation → Outer layer layout transfer → computer control and copper plating.
The PCB process design requirements are introduced in detail: 1, test point addition, 2, optical location point, 3, add working edge, 4, film file output, 5, plate rules, 6, board information annotation
PCB board making fee, material fee, SMT welding fee, steel mesh fee, PCBA fixture, PCBA test frame and packaging and transportation fee.