One - stop Electronic Manufacturing Services(EMS) Solution provider
BGA components and their assembly process(1) Visual inspectionFor package arrays such as BGA, without inspection equipment, first visually observe whether the collapse of the outermost solder joints is consistent, and then look at the chip against the lig
When SMT components are placed, connectors are placed first, followed by power circuits, sensitive and precision circuits, critical circuit components, and any other required components. You are selecting route priorities based on power level, noise sensi
When SMT components are placed, connectors are placed first, followed by power circuits, sensitive and precision circuits, critical circuit components, and any other required components. You are selecting route priorities based on power level, noise sensi
Electronic components procurement knowledge and processGenerally speaking, supplier development includes: analysis of supply market competition, finding qualified suppliers, evaluation of potential suppliers, inquiry and quotation, negotiation of contract
Electronic Components Procurement SummaryThe premise of purchasing is to understand and be familiar with what you purchase, that is, to learn the relevant knowledge of electronic components. Then comes the needs assessment, determining the type and quanti
Brief introduction to the main points of SMT assembly process of BGA componentsFPC factory When SMT (Surface Mount Technology)/SMD (Surface Mount Device) practitioners find that QFP (Quad Flat Package) with a pitch of 0.3mm cannot be realized, the emergen
At the same time, because the stiffness of the electronic housing is much greater than that of the PCB component, the finite element model imposes a fixed support constraint on the screw holes at four corners to simulate the screw connection between the P
The semi-molten solder paste is placed on the circuit board by the steel mold, and then the SMD components are pasted on it, and it is welded on the circuit board by reflow welding
It not only reduces the number of I/O interfaces and pins, but also makes it easier to wind PCB wires. Therefore, many RF component manufacturers have accelerated the development of MIPI interface solutions to further simplify the design complexity of car
The outermost wire or device of the PCB circuit board should be no less than 2mm away from the edge of the circuit board, which is conducive to the fixing of the PCB board and prevent the change of impedance value.
PCB circuit board manufacturers to PCB circuit board related design parameters detailed.
The designer determines the electrical performance and function of the components in the system structure and detailed circuit design stage, and determines the packaging form and structure of the surface assembled components in the SMT design stage accord