PCBA processing difference between patch components and plug-in components

In PCBA processing, patch components and plug-in components are used. So what is the difference between patch components and plug-in components in PCBA processing? Next, PCBA processing manufacturer kinhford Electronics will introduce you.

First, the difference between the two:

1, the patch components are small in size, light in weight, and easier to weld than plug-in components.

2, the chip element has a very important advantage, that is, to improve the stability and reliability of the circuit; Because the patch element has no leads, the stray electric and magnetic fields are reduced, which is especially effective in high-frequency analog circuits and high-speed digital circuits. Two, the welding method of the two

1, patch components welding method: 20 (1) https://www.kingfordpcb.com/yuan.php?time=1687220120

Put the component on the pad, apply the adjusted patch solder paste on the surface of the component and the contact point of the pad, and then heat the joint of the pad and the patch element with 20W internal heat electric soldering iron (the temperature should be 220~230℃), and remove the electric soldering iron after seeing the solder melt, and welding will be completed after the solder solidifies. After welding, you can clamp the welded patch component with tweezers to see if it is loose. If there is no loosening, it means that the welding is good. If there is loosening, you should re-apply the solder paste to re-weld according to the above method.

2, plug-in components welding method:

When soldering all pins, solder the tips of the iron and apply flux to all pins to keep them wet. Touch the end of each pin of the chip with the tip of the iron until the solder flows into the pin. After soldering all the pins, wet the pins with flux to clean the solder to eliminate any short circuits and lapping. Finally, use tweezers to check whether there is a spot weld, after the check is complete, remove the flux from the circuit board, dip the hard brush with alcohol along the direction of the pin carefully wipe until the flux disappears.

Electronics Co., Ltd. specializes in providing integrated PCBA electronic manufacturing services, including upstream electronic component procurement to PCB production and processing, SMT patches, DIP plug-ins, PCBA testing, finished product assembly and other one-stop services.

The company gives full play to its competitive advantages in scale procurement and quality control, and has signed long-term cooperation agreements with many electronic component manufacturers at home and abroad and around the world to ensure the quality and stable supply of raw materials, and transfer the benefits to customers.

When deciding the number of PCB design layers, the following issues should be taken into account: 1

Where will the PCB be used? PCBS are used in various types of simple to complex electronic devices. Therefore, the first thing to figure out is whether the application has minimal functionality or complex functionality.

2, the required signal type

The choice of the number of layers also depends on the type of signal they need to transmit, the signal is divided into high frequency, low frequency, ground or power supply, for applications requiring multi-signal processing, you need multi-layer PCB, these circuits may require different grounding and isolation.

3. Through hole type

The choice of through holes is another important factor to consider, if you choose to bury through holes, you may need more internal layers, so the multi-layer needs can be met accordingly.

4. Density and number of signal layers required

The PCB layer is also determined based on two important factors: signal layer and pin density. The number of layers in the PCB increases as the pin density decreases. Pin density is 1.0. For example, a pin density of 1 would require 2 signal layers. However, pin density. 0.2 May require 10 layers or more. 5. Number of planes required

The power and ground planes in the PCB help reduce EMI as well as shield the signal layer. Therefore, the choice of layer will again depend on the number of planes required. 6. Manufacturing cost

Although a major requirement, it is one of the determining factors in choosing the number of layers in a 1-40 layer PCB design. The cost of PCB manufacturing depends on the multiple layers. Multilayer PCBS are more expensive than single-layer PCBS, and manufacturing costs will largely depend on the above requirements. 7. Delivery time

Delivery times based on 1-40 layer PCB designs depend on all of the above factors. For example, if your design requires a single layer, the lead time may be less. If you are ordering PCBS for complex industrial electronics, the lead time will increase. Usually PCB designers will be based on the complexity of the design circuit schematic to determine the design of several layers of board, mainly from the schematic of the core device outlet and the difficulty of the layout of the appliance to decide. If you are unable to make a decision based on the above factors, it is best to discuss it with the manufacturer.