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The Chinese name of SMT chip processing (PCB) is called "printed circuit board", also known as printed circuit board, printed circuit board, is an important electronic component, is the support body of electronic components, is the provider of e...
For highly sensitive prototypes or components, we have a special gas phase welding process. In this process, the plate is heated until it reaches the specific melting point of the solder paste (Gordon). This allows us to weld at lower temperatures, or sol
To combat this growing phenomenon, researchers and manufacturers must compete with traffickers to be creative and find new strategies to fight.
Computer USB keys are something to talk about in 2016. The device is equipped with a DC-DC converter and capacitors responsible for connecting to send waste to the landfill, thus breaking the PC components. A Hong Kong company has copied the key and sold
All SMT machines can be programmed with manual input. In the mounting list of programming software, after entering the bit number (RefID) of the component, select the component database code of the component, input the x, y coordinates and rotation Angle
Many equipments in SMT line are automatic equipments controlled by computer, which makes it possible for cad/cam integrated system to be constructed by computer aided manufacturing.
Looking ahead, TAMURA's lead-free solder paste has been gradually replaced by leaded solder paste, and low silver solder paste has been developed to fill the automotive electronics gap; A variety of MALCOM SMT peripheral testing equipment is continuously
coating thickness: if you want to get a thicker coating, by coating two layers of thin coating to obtain, and must be in the first layer of completely cured before allowed to coat the second layer; the thickness of the film layer: the addition of diluent
The workshop supervisor of SMT patch processing and production shall reasonably arrange the workshop plan according to the weekly and monthly plan of PMC department and the material supply situation, and arrange the elongation of each line body and techni
The first point: size error problem second point: component offset problem third point: temperature control problem Fourth point: PCB board surface treatment problem
On pre-tinned PCB, the porosity of BGA joint increases with the increase of solvent volatility, metal composition and melting temperature, and also with the decrease of powder size.
SMT patch introductionSMT patch refers to the abbreviation of a series of process processes processed on the basis of PCB. PCB (Printed Circuit Board) is a printed circuit board.SMT is Surface Mount Technology (Surface Mount Technology) (abbreviation for