The designer determines the electrical performance and function of the components in the system structure and detailed circuit design stage, and determines the packaging form and structure of the surface assembled components in the SMT design stage accord
The package of hybrid circuit can adopt the base and cover of cutting metal, parallel seam welding, with good shielding effect.
Therefore, the boundary scanning method has special advantages when there is no test model or the nodes of the contact circuit are limited.
SMT patch process: 1, cleaning, 2, pre-welding: 3, patch: 4, welding: 5, detection: 6, assembly
Check the buffering action of the suction nozzle fixture of the parts of the patch machine on time. If the buffering action is not smooth, it is recommended to apply a thin layer of lubricant. If the fixture is loose, tighten the moving lens to clean the
With the expansion of 5G commercial pace, the upgrading of consumer electronic products and the emergence of new applications, the further growth of Internet traffic, and the increasing demand for switches and servers driven by the construction of data ce
With the expansion of 5G commercial pace, the upgrading of consumer electronic products and the emergence of new applications, the further growth of Internet traffic, and the increasing demand for switches and servers driven by the construction of data ce
Vertical refers to the component body perpendicular to the circuit board installation, welding, its advantage is to save space, horizontal refers to the component body parallel and close to the circuit board installation, welding, its advantage is that th
PCB has become the most important and key part of electronic information products. Its quality and reliability level determine the quality and reliability of the whole equipment.
In mixed-signal PCB design, there are special requirements for power wiring and the isolation of analog and digital noise from each other to avoid noise coupling, thus increasing the complexity of layout and wiring.
SMT factory layout and location requirements: 1, fire extinguisher placement area, 2, material rack car placement area, 3, material preparation table placement area, 4, printing station table placement area, 5, tin paste placement area, 6, after the furna
When selecting circuit board components based on component packaging, the following needs to be considered: component packaging selection. Grounding methods. Virtual component packaging. Verify complete material list data. Sort. Excess gate circuit.
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