In summary, by optimizing PCB design, using excellent solder to improve the solderability of circuit board holes and preventing warping to prevent defects, the welding quality of the entire circuit board can be improved.
Then use the same method to separate the other pins of the integrated circuit from the circuit board, and finally you can remove the entire integrated circuit.
When disassembling, melt the pin solder with the soldering iron, cover the pin with the needle in time, then remove the soldering iron and rotate the needle, and pull out the needle after the solder solidifies.
With the development of computer technology, printed board CAD technology has made great progress, PCB production technology level also continues to multi-layer, fine wire, small aperture, high density direction rapidly improved.
it is difficult to assemble, and sometimes it will damage integrated circuit and PCB board. Here summarizes several effective integrated circuit assembly methods for your reference.
In PCB board design and circuit board production, engineers not only need to prevent PCB board accidental encounters during the manufacturing process, but also need to avoid design errors.
in the manufacturing process of PCB, the three stages that must be tested are the inner layer after etching, the outer line after etching, and the finished product.
This is done by making multiple design changes to a small number of boards and then testing all variants before the next manufacturing run. These variants are for assembly only, and all bare plates are manufactured in a similar manner.
bottom solder layer top solder layer drill guide, multilayer mechanical layer is to define the appearance of the entire PCB board, in fact, when we say the mechanical layer is referring to the overall structure of the PCB board.
Some circuit board shape is special, different shape, through the board can be more effective use of PCB substrate area, reduce waste, save costs.
This article will effectively take you through the stages of the printed circuit board design process, but will focus more on the etching and stripping process of the board.
Positioning holes on printed circuit boards should be represented by special graphic symbols. When the requirements are not high, the printed circuit board can also be used in the larger assembly hole instead.
