At present, lead-free environmental protection is a technical challenge for PCB manufacturers and PCBA manufacturers. A lot of manpower and material resources have been spent on PCB design. The following progress has been made: 1. Improvement of the speci
The copper layer on the PCB is easily oxidized, so the resulting copper oxide layer can seriously degrade the weld quality, thereby reducing the reliability and effectiveness of the final product.
In order to meet customer requirements, the pass-through hole plugging process is varied, the process is particularly long, the process control is difficult, often in hot air leveling and soldering experiment oil loss; Oil explosion after curing.
All the work of the digital circuit is inseparable from the clock signal. The crystal oscillator directly controls the whole system. If the crystal oscillator does not operate, the whole system will be paralyzed.
In terms of manufacturing cost, with the same PCB area, the cost of multilayer boards is definitely higher than that of single and double layer boards, and the more layers, the higher the cost.
The arrival of the intelligent age, not only brings convenience to people's lives, but also has a profound impact on all industries, so the PCB copy board, design put forward higher requirements, professional PCB copy board companies should continue to im
The adoption of high speed PCB design means constitutes the controllability of the design process, only controllable, is reliable, can also be successful!
The main reason of reflection signal: too long running; Transmission lines with unmatched terminations, excess capacitance or inductance, and impedance mismatches.
The generation of grooving can be summarized into the following two cases :1. Grooving caused by power/ground plane segmentation; 2.the through hole is too dense to form grooves.
Grounding should be added when necessary, two adjacent layers of wiring should be vertical to each other, parallel easy to produce parasitic coupling.
Multilayer circuit board, usually through the hole plate, first board, second board, second stack plate these several. Higher level such as three - level board, arbitrary layer interconnection board usually used very little.
unused gate circuits are often used for design improvements later, and they may be converted into circuits. So it is also important that they are tested from the start to ensure that their artifacts are reliable.
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