Buried, blind hole structure of the printed circuit board, generally use the "sub-board" production mode to complete, which means that after several times of pressing plate, drilling, hole plating and so on to complete, so precise positioning is...
In high speed PCB, RF energy is usually coupled between the power plane and the ground plane to become the edge flux leakage.
There are many kinds and numbers of holes and complex shapes of single-sided paper substrate and double-sided non-metallic holes of epoxy glass cloth substrate.
It is a short name for dynamicviscosity. The viscosity is generally expressed in terms of the shear stress of the fluid flow divided by the velocity gradient in the direction of the flow layer in international units of Pa/s (Pa). S) or millipa/second (mPa
That is, on the copper foil part of the outer layer of the board to be retained, that is, on the graphic part of the circuit, a layer of lead tin corrosion resistance layer is pre-plated, and then the rest of the copper foil is etched away by chemical mea
General engineers only consider the design of system functionality when designing, but it is possible that the system needs surge design, and the transient surge current should reach 3KA.
The PCB mounting holes help secure the PCB to the housing. But this is its physical mechanical use, in addition, in electromagnetic function, PCB mounting hole can also be used to reduce electromagnetic interference.
how to improve the appearance quality of the printed circuit board flux resistance has become an urgent problem to be solved in every PCB factory. Factors that affect the appearance quality of solder resistance
These components cannot be inserted or attached to the holes and surface pads of the circuit board and can even damage automatic cassette loaders. Welded circuit board components, bending components, feet neatly cut.
One example is the difference between blind and buried holes in circuit boards. Here is all the information about what blind and buried hole technologies are in PCBS.
PCB board warping occurs when the stress on the board is not uniform or when the resistance to stress is not uniform in each area of the board.
In the process of transmission, if the characteristic impedance of the transmission path changes, the signal will reflect at the node where the impedance is discontinuous.
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