Therefore, on SMT printed boards, through holes are used only to connect the wires on both sides of the board, the number of holes is much smaller, and the diameter of the holes is much smaller. In this way, the assembly density of the circuit board can b
The development trend of PCB manufacturing technology in the future is to high density, high precision, fine aperture, fine wire, small spacing, high reliability, multi-layer, high-speed transmission, light weight, thin shape.
Flexible Printed Circuit (PCB) can be designed with the general design of PCB software. Also use Gerber format for FPC manufacturers. Because the manufacturing process is different from ordinary PCBS, each manufacturer will have their own limits on minimu
Flexible Printed Circuit (PCB) can be designed with the general design of PCB software. Also use Gerber format for FPC manufacturers. Because the manufacturing process is different from ordinary PCBS, each manufacturer will have their own limits on minimu
At the same time, it must be easily removed by flux quickly in the subsequent welding high temperature for welding. OSP process is simple, low cost, widely used in PCB manufacturers.
The bubbling of the circuit board is actually the problem of poor binding force on the board, and by extension, the surface quality of the board, which contains two aspects.
The drilling process can be completed by inputting the drilling coordinate program in the PCB file on the drilling machine and adjusting the corresponding drilling speed. In the via process, drilling accuracy, position deviation and bit fracture must be m
Starting from the most basic PCB board, this paper discusses the function and design skills of PCB stacking in controlling EMI radiation.
PCB circuit board manufacturers to PCB circuit board related design parameters detailed.
High Tg material: the so-called Tg value, now electronic products require the circuit board to be resistant to high temperature, at a certain temperature, the circuit board can not burn, can be softened, the softening temperature is called glass conversio
In low-frequency circuits, where the signal frequency is less than 1MHz, the inductance between the wiring and components can be ignored, and the voltage drop generated on the resistance of the ground circuit has a great impact on the circuit, so the sing
In order to suppress the cross talk between the printed circuit board wires, in the design of wiring should be as far as possible to avoid long distance equal wiring, as far as possible to open the distance between lines, signal lines and ground and power
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