The process parameters related to copper electroplating of full-board PCB adopt a high-acid and low-copper formula to ensure the uniformity of plate thickness distribution.
The main components of the bath are copper sulfate and sulfuric acid, and the formula of high acid and low copper is adopted to ensure the uniform thickness distribution of the plate and the deep plating ability of deep holes during electroplating.
Copper plating is the most widely used in order to improve the adhesion of the coating and a kind of precoating, this paper we will introduce the copper plating technology in PCB process encountered common problems and their solutions.
printing material dry too fast, in the screen version dry plugging hole, printing speed is too fast, scraper strength is too high. Solution, should use volatile organic solvent slow printing material, with soft cloth stained with organic solvent gently cl
Understand PCB design, PCB assembly and PCB layout in PCB related industries, and Describe the reason for PCB electroplating coating design
PCB manufacturers, PCB designers and PCBA manufacturers explain to you why the warpage of PCB boards is different? Thickness of pcb electroplating film
Circuit board manufacturing, circuit board design and PCBA processing manufacturers explain to you the defects of PCB electroplating pure tin
Kingford is a PCB company engaged in the production and assembly of circuit boards. We not only sell PCBA, but also have many strategies related to PCB design and PCB proofing. Next, let me introduce you to some matters related to PCB.
PCB manufacturing, PCB design and PCBA processing manufacturers will explain to you the precautions for PCB electroplating line and the knowledge to be mastered for wiring
PCB manufacturing, PCB design and PCBA processing manufacturers will explain the maintenance of PCB electroplating equipment and PCB flying pin test
This article mainly introduces the maintenance of PCB electroplating production line
This article is about the electroplating process management of PCB electroplating production in PCB process