How to reduce PCB board space with the smallest device?
Chip-on-chip (WCSP) or core-sized ball grid arrays (DSBGA) use fine-pitch wire bonding and flip-chip interconnection, and are available in SiP, modular, stacked and recessed core-based formats.
Chip-on-chip (WCSP) or core-sized ball grid arrays (DSBGA) use fine-pitch wire bonding and flip-chip interconnection, and are available in SiP, modular, stacked and recessed core-based formats.
The high-rise plate is thicker, heavier and larger than the conventional multilayer plate. The corresponding heat capacity is also larger. When welding, more heat is needed and the welding high temperature time is longer.
In the core structure, all the conductive layers in the circuit board are coated on the core material; In the foil-coated structure, only the internal conductive layer of the circuit board is applied to the core material, and the external conductive layer
If the transmission line is isotropic, there will always be a current as long as the signal is transmitted.
The properties of the developed substrate materials are provided to the designer of the whole electronic products in time, so that the designer can establish accurate and advanced data basis.
an all-digital system may not have a separate analog power plane, and adding a new power plane can become prohibitively expensive unless the designer creates a partitioned island or separate plane on top of the existing layer.
Many peers have completed the planning of electronic products often appear problems. Related to the lack of necessary elements in the planning of electrical principles, but more important is when all necessary elements are considered.
Gold deposition is used by chemical deposition, through the method of chemical REDOX reaction to generate a layer of coating, generally thick, is a kind of chemical nickel gold deposit method, can reach a thicker gold layer.
With the 3D capabilities of the layout tool, designers can interactively handle their component placement in real time and correct all clearance errors in the design's mechanical features.
The cooling metal block of the three-end voltage regulator must be well grounded. The grounding isolation belt near the crystal oscillator must be well grounded.
With the rapid development of mobile phone, electronics, communication industry, automatic driving, to a large extent, the PCB circuit board industry continues to grow and grow rapidly, people for the quality of PCB components, layers, weight, precision,
At the same time, physical and chemical changes are formed on the surface of the functional groups of the gas composition, so as to improve the bonding force of copper plating, pollution removal and other plate loading effects.