Cause of the tin tip phenomenon in wave soldering long pin components: Most of the flux on the circuit board will be washed away, leaving flux between the PCB board and the tin wave. When the PCB board leaves the tin wave, the flux left on the PCB board p
The challenge for the flexible circuit industry is to take advantage of its technological advantages and stay abreast of computers, telecommunications, consumer demand, and dynamic markets.
The signal layers are all layers with electrical connections, which is the actual copper layer. Intermediate layer refers to the intermediate plate layer used for wiring, in which the wire is distributed.
In Shenzhen, there are a lot of patch processing manufacturers, these manufacturers are uneven in quality, the price is not the same, so before the production, you can choose the following advantages of the patch processing plant: a, a high degree of prof
RF designs must be thoroughly and carefully planned at the beginning of the design process, with a thorough and continuous evaluation of progress at each design step.
PCB board selection must meet the design requirements, mass production, cost balance. In short, the design requirements include both electrical and structural reliability.
Needless to say, the PCB industry is facing increasing challenges and competition. But in trouble, lying flat can not save themselves, only fight, can be reversed.
This type of graphic plating is characterized by the presence of a copper coating only under the lead tin resist layer. Alternatively, the entire plate is coated with copper, with only tin or lead-tin resist outside the film
General engineers only consider the design of system functionality when designing, but it is possible that the system needs surge design, and the transient surge current should reach 3KA.
The PCB mounting holes help secure the PCB to the housing. But this is its physical mechanical use, in addition, in electromagnetic function, PCB mounting hole can also be used to reduce electromagnetic interference.
how to improve the appearance quality of the printed circuit board flux resistance has become an urgent problem to be solved in every PCB factory. Factors that affect the appearance quality of solder resistance
PCB as the core substrate of electronic products, its quality and reliability directly affect the quality and reliability of electronic products, so high reliability PCB has become the basic requirements of many electronic products.
