PCB production is divided into: layout → core board production → inner layer layout transfer → drilling and inspection → lamination → drilling → copper chemical precipitation → Outer layer layout transfer → computer control and copper plating.
In PCB board production, only two steps will use film stripping. D/F stripping after etching of the inner line and D/F stripping before etching of the outer line (if the outer line is made into a negative film process).
Effective techniques to improve PCB design spread rate and design efficiency: first, PCB board size and wiring layer number need to be determined in the early design, second, automatic wiring tool itself does not know what should be done, third, in the la
Common pads are: 1, square pad, 2, round pad, 3, island pad, 4, polygonal pad, 5, oval pad, 6, open shape pad
What inspection should be done before SMT patch processing: first, SMT patch components inspection, second, printed circuit board (PCB) inspection, third, SMT patch processing precautions
Note for circuit board welding: 1, after getting the PCB bare board, first check the appearance; 2, after the materials required for circuit board welding are complete; 3, when selecting components for welding, welding should be carried out in the order o
The causes of SMT printing leakage and tin deficiency are as follows: 1. Tin paste printing principle, 2. Observation, thinking, comparison, 3. Bare copper plate printing verification
Materials for PCBA electronic products patch processing: 1. Complete PCB board making file and board making requirements; 2. 2. Complete BOM, 3. PCBA assembly drawing, PS: report the cost of PCBA function test, and provide the method of PCBA function test
SMD materials must be exquisite, not ready for SMT patch proofing. There are still some problems with SMD materials, from the quantity of incoming materials to the specific specifications and parameters of the materials, we must pay attention to, so that
PCBA in the manufacturing need to consider the issues :1, automatic production line veneer transmission and positioning elements design,2, PCBA assembly process design,3, component layout design,4, assembly process design
The warping of PCB circuit boards has great influence on the production of printed PCB circuit boards, and warping is one of the important problems in the production process of PCB circuit boards. Bent, component foot is difficult to clean.
One of the causes of PCB warping is that the substrate used may warpage, but in the process of PCB processing, due to thermal stress, chemical factors, and improper production process will also cause PCB warpage.
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