The difference between leaded and lead-free processes is that the welding method is different. The lead process uses lead-tin alloy, the welding temperature is low, and the operation is relatively simple. Lead-free process is the use of lead-free solder i
It is important to note that the final performance rating (assembly, welding, cleaning and testing) of a PCBA cannot be higher than the performance rating specified for a bare board or prefabricated PCB. Therefore, to obtain a Class 3 PCBA, IPC Class 3 mu
The higher the Td, the slower the burn rate. Materials with Td equal to or below 300°C are suitable for eutectic tin-lead welding. Materials with Td above or above 300°C are more suitable for lead-free welding. In this case, the higher the Td value, the h
Challenge: Equipment is expected or required to maintain as uniform surface pressure as possible to improve the quality of processed products
Reflow welding: After the component is inserted, heat is started using an assembler. In this process, the plate is heated inside the reflow furnace by an assembler and the process continues until a solder joint is formed. This happens by providing the des
During the manufacturing process, various conditions can and will cause solder bridging. Welding Bridges can come from manufacturing equipment in use or even decisions made during the design process. Here are some of the more common reasons for solder bri
Assembly drawings vary according to different assembly templates. Most of the time, because electronic products use the printed circuit board described below, the printed circuit board diagram is the main form of assembly diagram
Suitable paper is used to print the design and transfer it to bakelite, we will use vinyl support paper for labels, another one that gets very good results is adhesive paper support.
A few years ago, a colleague contacted me with a question: "How can we weld a plate with a Tg of 180°C or even 200°C at 225-245°C without damaging the plate? Even with lead boards, the peak reflux temperature is much higher than the Tg of the boards....
Measurement of scraper pressure distribution in the solder paste printing process industry: printed circuit board (PCB) electronic component installation challenge: When printing paste solder screen onto the printed substrate, any non-uniformity of scrape
Transforming your design into a complete physical structure requires three steps: 1) manufacturing, 2) component procurement and 3) assembly. Printed circuit board assembly or PCBA is one of two PCB manufacturing processes. The other stage is manufacturin
The external processing of three anti-paint is bound to cause the continuous transfer of PCBA, which is easy to cause collision, ESD electrostatic breakdown and other potential defects. PCBA factories need to be equipped with three anti-paint spraying pro
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