The parameters of PCB board layer, the distance between signal wires, the electrical characteristics of the driver and receiver end, and the connection mode of signal wires all have a certain influence on the crosstalk.
All of these problems can cause the solder shield to detach from the circuit board and eventually lead to corrosion of the copper circuit. Poor insulation characteristics can cause short circuits due to unexpected electrical connectivity/arcing.
Defective sheeting requires special assembly procedures. If the end-of-life unit board (x-out) is not clearly marked, or it is not isolated from the sheeting, the known defective board may be assembled, wasting parts and time.
According to experience, the effect of RF circuit not only depends on the performance of the RF circuit board itself, but also depends on the interaction with the CPU processing board.
these problems can be avoided. Because the design of the circuit board will vary according to different equipment, different use locations, different heat dissipation requirements, and different electromagnetic interference (EMI) situation, then the desig
Even if the oxidation after a long time of use will almost only occur in the insertion and removal of the connection part, and there is no impact on the welding pad and the welded components.
As the growth and shrinkage stability of soft plate material is poor, the production of soft plate and pressed PI covering film should be given priority, and the hard plate part should be made according to its growth and shrinkage coefficient.
There are many factors causing the coating cavity, the most common is PTH coating cavity, by controlling the relevant process parameters of the potion can effectively reduce the generation of PTH coating cavity.
The main signal line is best concentrated in the center of the PCB board.The clock generator circuit should be near the center of the PCB board, and the clock fan out should be Daisy chain or parallel wiring.
In addition, before the solder resistance film coating, the printed circuit board surface is treated by plasma, and a certain roughness and high activity surface can be obtained, so as to improve the adhesion of the solder resistance film.
Now the production of gold plate is rarely, in the actual trial process, 90% of the gold plate can be replaced by gold plate sinking gold plate, gold plate welding poor is his fatal shortage, is also the direct cause of Princecircuit to give up gold plate
The parasitic capacitance through the hole can cause the signal rise time to be prolonged and the transmission speed to be slowed down, thus deteriorating the signal quality.
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