the current motherboard, memory and graphics card and other equipment "gold finger" is almost all made of tin material, only part of the high performance server/workstation accessories contact point will continue to use gold plating, the price i...
With the introduction of surface mount technology, automatic detection technology of circuit board is applied, and the packaging density of circuit board increases rapidly.
depending on the thickness of the gold layer, if the thickness is thin, the nickel layer may appear in the gold layer due to diffusion and oxidation, affecting the reliability, not inadvertently.
Many customers use pad(plug-in holes) to represent conductive holes, thus causing your conductive holes to open the window. Then please check your document design! At this point in time,
This process can ensure that the oil cover through the hole is good, the plug hole is smooth, the wet film color is consistent, the hot air leveling can ensure that the through hole is not tin, no tin beads in the hole, but it is easy to cause the ink pad
A persistent semiconductor shortage is rapidly snowballing into a full-blown component shortage, underscoring the fragility of the current supply chain.
High speed devices are particularly sensitive to this, and will thus receive high speed false signals, while low speed devices will ignore such false signals.
The reflection of the signal back to the signal source will increase the system noise, making it more difficult for the receiver to distinguish the noise from the signal,
In particular, note that the bypass capacitor needs to pass through two holes when connecting the power layer to the formation, so that the parasitic inductance of the holes will be multiplied.
When we combine the forward - clock - oriented field and the reverse - clock - oriented field, the effect of elimination can be produced.
The above examples can help us understand Maxwell equations and PCB routing, and they are illustrated by very simple mathematical formulas.
In PCB, EMI can be produced for many reasons, such as: RF current, common mode level, ground loop, impedance mismatch, magnetic flux
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