PCBA processing process
According to the welding pad surface treatment classification: organic weldability protection layer (OSP), nickel metal leaching (ENIG), nickel palladium leaching (ENEPIG), silver Immersion silver, tin immersion.
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Circuit board PCBA processing process is introduced
Circuit board PCBA processing process can be roughly divided into: empty plate loading - printed solder paste - mounting devices - reflow welding -AOI testing - receiving plate - finished product inspection - parts after welding - circuit board open/short
PCBA processing process and how to deal with the surface after PCBA welding
PCB manufacturing, PCB design and PCBA processing manufacturers will explain the PCBA processing process and how to deal with the surface after PCBA welding
Solder paste process, technical requirements and scope of application
PCB manufacturers and PCB designers explain the solder paste process, technical requirements and scope of application
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Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.