as PCB substrate epoxy resin (see the column of PCB substrate resin chapter), PCB substrate reinforcement materials, copper foil and other manufacturing technologies have not realized commercial production.
Otherwise, you may be forced to make modifications and redesign your PCB stack structure.
In addition, with the increase of width, PCB current-carrying capacity does not increase strictly in line with the linear increase
This will break the solder joints, bend the shape of the board, or it may cause the copper thread on the board to break.
This technology has become a necessary means of detection in fine wire production, and is being rapidly popularized, applied and developed.
the following methods can be used to balance the cascade, reduce the cost of PCB production and avoid PCB bending.
It is important to note that the power layer should be near the layer that is not the main component plane, because the bottom plane will be more complete. Therefore, EMI performance is better than the first scheme.
the thermal performance index analysis software module added in some professional PCB design software can help designers optimize circuit design.
Choose as large a component as possible when designing the power resistance, and adjust the layout of the printed board to allow enough space for heat dissipation.
there are still some differences between high frequency products and high speed products in the demand for plate.
TPM and other high-end knowledge, but ignore the field management, ignore the most basic production activities of the people and equipment.
The following is its structure diagram (about circuit symbols and functions will be explained later) :IC design: CMOS devices and their circuits，
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