How to choose PCB surface treatment process?
The results show that the latest organic coating technology can maintain good performance in multiple lead-free welding processes.
The results show that the latest organic coating technology can maintain good performance in multiple lead-free welding processes.
Many customers use pad(plug-in holes) to represent conductive holes, thus causing your conductive holes to open the window. Then please check your document design!
In the real world, in addition to considering signal quality, power source plane coupling (using adjacent ground planes to reduce AC impedance of the power plane) and layered symmetry are all factors to be considered.
When selecting the driver chip, in addition to ensuring that it basically matches the load and that the signal edge meets the requirements (generally, the clock is an effective signal along the clock), the time delay of the clock in the driver chip should
one is that two lines walk on the same layer (side-by-side), the other is that two lines walk on two adjacent layers (over-under). Generally, there are many ways to implement the former side-by-side.
The dielectric constant of substrates and prepreg materials using epoxy glass can be controlled by changing the percentage of resin content.
In order to minimize the chance of PCB board distortion and obtain a flat finished board, the layering of the multi-substrate board should be kept symmetrical.
a large number of pre-test printing solder paste production several pieces to determine no solder problems before continuing to production.
The main reason of reflection signal: too long running; Transmission lines with unmatched terminations, excess capacitance or inductance, and impedance mismatches.
There is a little bit of short circuiting between digital and analog, but note that there is only one connection point. There are also differences on the PCB, which is determined by the system design.
The size of inductive crosstalk depends on the proximity of two loops, the size of the loop area, and the impedance of the load affected.
In the actual study, we can conclude that there are four main interference, including power supply noise, transmission line interference, coupling and electromagnetic interference (EMI). Through analyzing various interference problems of high frequency PC