The simultaneous dumping of current underground may temporarily raise the ground's electrical potential, causing a change in reference, a phenomenon known as ground rebound. The main conditions that affect grounding bounce include load capacitance, socket
an all-digital system may not have a separate analog power plane, and adding a new power plane can become prohibitively expensive unless the designer creates a partitioned island or separate plane on top of the existing layer.
Many peers have completed the planning of electronic products often appear problems. Related to the lack of necessary elements in the planning of electrical principles, but more important is when all necessary elements are considered.
Gold deposition is used by chemical deposition, through the method of chemical REDOX reaction to generate a layer of coating, generally thick, is a kind of chemical nickel gold deposit method, can reach a thicker gold layer.
With the 3D capabilities of the layout tool, designers can interactively handle their component placement in real time and correct all clearance errors in the design's mechanical features.
The cooling metal block of the three-end voltage regulator must be well grounded. The grounding isolation belt near the crystal oscillator must be well grounded.
The manufacturing process of dry press PCB electronic ceramics mainly includes blank forming, blank sintering and finishing, forming circuit on the substrate.
With the rapid development of mobile phone, electronics, communication industry, automatic driving, to a large extent, the PCB circuit board industry continues to grow and grow rapidly, people for the quality of PCB components, layers, weight, precision,
These PCBS are widely used in mechanically sensitive devices because the flexibility allows the board to resist vibration. Flexible PCB is more durable than traditional PCB, but flexible PCB manufacturing process is sensitive and complex.
At the same time, physical and chemical changes are formed on the surface of the functional groups of the gas composition, so as to improve the bonding force of copper plating, pollution removal and other plate loading effects.
The most effective way to increase PCB density is to reduce the number of through-holes and precisely set blind and buried holes to achieve this requirement, resulting in the HDI board.
It is a test method in which the assembled plate is supported by two cross bars from the outside of the lower plate surface, and then pressed down from the third point of the upper center to form a plate bend, and then the strength of each solder joint is
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