Virtual welding is a very common line fault, one is in the process of circuit board production, caused by improper production technology, when the unstable state; The other is that after long-term use of electrical appliances, some of the more serious hea
With the appearance of 100 megabit bus, when the signal edge rate reaches picosecond level, the system performance depends more on the front-end design, requiring accurate timing analysis and calculation at the beginning of design. Timing analysis and sig
In Shenzhen, there are a lot of patch processing manufacturers, these manufacturers are uneven in quality, the price is not the same, so before the production, you can choose the following advantages of the patch processing plant: a, a high degree of prof
The adoption of high speed PCB design means constitutes the controllability of the design process, only controllable, is reliable, can also be successful!
unused gate circuits are often used for design improvements later, and they may be converted into circuits. So it is also important that they are tested from the start to ensure that their artifacts are reliable.
There are many aspects of PCB design that need to take into account the safe spacing. It is classified into two categories: one is electrical related safety spacing and the other is non-electrical related safety spacing.
It is best not to use electrolytic capacitors, electrolytic capacitors are two layers of thin film rolled up, this rolled up structure at high frequency performance as inductance, the best use of bile capacitors or polycarbonate gestation capacitors.
In the actual design, the frequency, power rate and gain should be considered comprehensively to decide whether to add shielding plate.
PCB ink quality is excellent, in principle can not be separated from the combination of the above major components. Ink quality is excellent, is the formula of science, advanced and environmental protection of the comprehensive embodiment.
Thin substrate material should be selected for 5G high-frequency plate. Meanwhile, material characteristics such as high thermal conductivity, smooth surface of copper foil and low loss factor should be selected to reduce heating.
This paper introduces various techniques of the three types of interconnect design, including device installation methods, wiring isolation and measures to reduce lead inductance.
In order to alleviate this design pressure, communication chip manufacturers have to choose to develop higher speed IC products to meet the needs of large capacity and small volume products.
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